Manufacturing Bits: Dec. 7


Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more

Change Management With Impact Analysis During Safety-Critical IP And SoC Development


Standards like ISO 26262 provide guidance to mitigate safety risks by defining safety analyses requirements and processes. The standard describes Change Management as a way to analyze and control changes in safety-related work products, items, and elements throughout the safety lifecycle. Impact analysis, a part of the Change Management process, is a systematic approach for evaluating changes t... » read more

Power/Performance Bits: Dec. 7


Logic-in-memory with MoS2 Engineers at École Polytechnique Fédérale de Lausanne (EPFL) built a logic-in-memory device using molybdenum disulfide (MoS2) as the channel material. MoS2 is a three-atom-thick 2D material and excellent semiconductor. The new chip is based on floating-gate field-effect transistors (FGFETs) that can hold electric charges for long periods. MoS2 is particularly se... » read more

Transforming Vision Inspection With Machine Learning


How auto-manufacturers can apply ML & AI algorithms to enhance image analytics on their factory floor and to ensure higher product quality? Discover the next generation visual inspection in our new case study. In this case study , you will learn about: Current limitations of image inspection in the manufacturing industry. The O+ end-to-end solution, which brings machine learning and... » read more

Learning ISO 26262 – 2nd Edition


You might think that when you get into a debate with a customer or a supplier about the exact interpretation of some aspect of ISO 26262, all you have to do is go to the standard, look it up, and there’s the answer you all need, plain as day. That would be ideal but often doesn’t reflect reality. To realize why, you have to understand the background to the standard. A short ISO 26262 o... » read more

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP


Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Week In Review: Manufacturing, Test


Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

Week In Review: Design, Low Power


Xilinx acquired the assets of Falcon Computing Solutions, a provider of high-level synthesis (HLS) compiler optimization technology for hardware acceleration of software applications. The acquisition will be integrated into the Xilinx Vitis Unified Software Platform to automate hardware-aware optimizations of C++ applications with minimal hardware expertise. “Our compiler provides a high degr... » read more

Week In Review: Auto, Security, Pervasive Computing


Security The United States Department of Defense added China's SMIC to its blacklist for its alleged cooperation with the Chinese military, reports Reuters. U.S. investors are asked not to invest in SMIC, among 35 other companies based in China on the list. Intel Labs launched the Private AI Collaborative Research Institute with Avast and Borsetta, to advance and develop technologies in pri... » read more

How Will Future Cars Interact With Humans?


Future automobiles may come with a set of controls very different from what we’re used to now. Mechanical knobs and switches already are being replaced by touchscreens, but that's just the beginning. There are a multitude of other possible ways in which drivers can interact with their vehicles, and the list is growing as technology drives down the cost of this new human-machine interface (... » read more

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