Critical Area-Based Test Pattern Optimization For High-Quality Test
By Mentor, a Siemens Business - 02 Sep, 2020 - Comments: 0

Among the challenges for DFT engineers is how to set a target metric for ATPG and how to choose the best set of patterns. Traditional coverage targets based on the number of faults detected doesn’t consider the likelihood of one fault occurring compared to another. Tessent developed total critical area ATPG technology that enables the sorting and ordering of patterns based on their likelihood... » read more

Components For Open-Source Verification
By Brian Bailey - 02 Sep, 2020 - Comments: 2

Defining an open-source verification methodology is a lot more difficult than just developing an open-source simulator. This is the reality facing open-source hardware such as RISC-V. Some people may be asking for the corresponding open-source verification, but that is a much tougher problem — and it is not going to be solved in the short term. Part one examined the reasons why open-source... » read more

Why Designing ICs From The Ground Up For Automotive Applications Matters
By Maxim Integrated - 02 Sep, 2020 - Comments: 0

Today's cars are computers on wheels, with multiple systems talking to each other constantly to deliver intelligence that keeps drivers and passengers safe, comfortable, and entertained while taking them from point A to point B. While we're not quite ready to completely welcome fully autonomous self-driving cars on our roadways, we are experiencing the benefits of Level 2 and Level 3 autonomous... » read more

Startup Funding: August 2020
By Jesse Allen - 02 Sep, 2020 - Comments: 0

Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

Blog Review: Sept. 2
By Jesse Allen - 02 Sep, 2020 - Comments: 0

Arm's Pranay Prabhat highlights research into zero-power or low-power sensing devices and work toward designing a microcontroller that could fit with DARPA N-ZERO sensors. Mentor's Shivani Joshi provides a primer on the ODB++ standard data exchange file format that generates PCB design data files for use in fabrication, assembly, and test. Cadence's Paul McLellan shares some highlights fr... » read more

Manufacturing Bits: Sept. 1
By Mark LaPedus - 01 Sep, 2020 - Comments: 0

AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Power/Performance Bits: Sept. 1
By Jesse Allen - 01 Sep, 2020 - Comments: 0

Cooling sensors with lasers Researchers at the University of Washington developed a way to cool a solid semiconductor sensor component with an infrared laser. The laser was able to cool the solid semiconductor by at least 20 degrees C, or 36 F, below room temperature. The device uses a cantilever, similar to a diving board, that can oscillate in response to thermal energy at room temperatur... » read more

Getting Particular About Partitioning
By Ed Sperling - 31 Aug, 2020 - Comments: 0

Partitioning could well be one of the most important and pervasive trends since the invention of computers. It has been around for almost as long, too. The idea dates back at least as far back as the Manhattan Project during World War II, when computations were wrapped within computations. It continued from there with what we know as time-sharing, which rather crudely partitioned access by p... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Bridging The Gap Between Driven And Driverless Cars
By Bryce Johnstone - 31 Aug, 2020 - Comments: 0

Today, 91% of car accidents worldwide are caused by some form of human error. Moving to ADAS functions, such as Automatic Emergency Braking or Lane Keep Assist, and autonomous vehicles (AVs) will significantly improve road safety and reduce costs associated with accidents, such as car and highway repair, police, ambulance, and insurance. However, to be fully autonomous will take many years, if ... » read more

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