Configuring Processors In The Field
By Brian Bailey - 08 Jun, 2020 - Comments: 0

The convergence of two technologies, extensible processors and embedded FPGAs, is enabling the creation of processors that can be dynamically configured in the field. But it's not clear if there is a need for them or how difficult would it be to program them. This remains an open question even though there is evidence of its usefulness in the past and new products are expected to reach the mark... » read more

Startup Funding: May 2020
By Jesse Allen - 08 Jun, 2020 - Comments: 0

It was a good month for semiconductor startups, with investment spanning a larger company in later funding rounds to brand new seed funding for two chip manufacturing startups. Two AI hardware startups bridge data center and edge, plus EV companies around the world get funding. In total, the eighteen startups profiled this month raised $446.3 million. Semiconductor & design Shanghai-based ... » read more

Figuring Out Binary Datalog Formats Without A Specification
By yieldHUB - 08 Jun, 2020 - Comments: 0

Being in the realm of semiconductor data with a wide range of customers, companies often throw interesting technical challenges at us. The most complex one so far this year is probably a request (OK, a requirement!) to interpret binary test datalog files so that they can then be analysed from our yieldHUB database system. The company provided us with little information on the actual binary form... » read more

NanoResolution MRS Sensor Delivers Fast, Precise 3D Inspection And Measurement For Advanced Semiconductor Packaging Applications
By CyberOptics - 08 Jun, 2020 - Comments: 0

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

IEEE S3S 2019 — Characterization Challenges And Solutions For FDSOI Technologies
By PDF Solutions - 08 Jun, 2020 - Comments: 0

FDSOI technology has been proposed as an alternative device scaling path which offers benefits of tunable, superior electrostatics transistor while maintaining simplicity of planar integration. New device type and integration elements brought up challenges in device and process characterization and monitoring across the whole lifecycle of the technology. This paper presents successful applicati... » read more

Power/Performance Bits: June 8
By Jesse Allen - 08 Jun, 2020 - Comments: 0

High temp capacitor Researchers at Pennsylvania State University doped a dielectric capacitor to increase storage capacity while also increasing electric charge efficiency, enabling the capacitor to withstand greater voltage with very little energy loss at temperatures higher than 300 degrees Fahrenheit. “What we have done is to use interface effects in nano-dopants to increase both the stor... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Jun, 2020 - Comments: 0

Materials A major setback has been dealt to the United States’ efforts to develop rare earths. The U.S. is attempting to develop its own supply of rare earths, hoping to reduce its reliance on China. China controls nearly 90% of the world’s rare earths, which are used in magnets and various electronic systems. In April, the U.S. Department of Defense (DoD) awarded two U.S.-based firms, Lyn... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Jun, 2020 - Comments: 1

Tools & IP Synopsys introduced its DesignWare USB4 IP solution consisting of controllers, routers, PHYs, and verification IP. It supports USB4, DisplayPort with HDCP 2.3 security, PCI Express, and Thunderbolt 3 connectivity protocols through USB Type-C connectors and cables. The USB4 IP operates at up to 40 Gbps, twice the maximum data rate of USB 3.2, and is backwards compatible with USB 3... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 05 Jun, 2020 - Comments: 0

Edge, cloud, data center Synopsys launched its USB4 IP and tools, already with a successful tapeout of a USB4 PHY test chip on 5nm advanced FinFET process. The Designware USB4 IP’s throughput is up to 20 or 40 Gbps, which Synopsys says is the bandwidth needed for high-performance edge AI, storage, PC, and tablet SoC designs. Also, Samsung Foundry certified Synopsys’ Design Compiler NXT for ... » read more

Designing The Next Big Things
By Ed Sperling - 05 Jun, 2020 - Comments: 0

The edge is a humongous opportunity for the semiconductor industry. The problem, despite its name, is that it's not a single thing. It will be comprised of thousands of different chips and systems, and very few will be sold in large volumes. The edge is the culmination of decades of improvement in power and performance, coupled with the architectural creativity that has exploded since the bene... » read more

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