NVM Reliability Challenges And Tradeoffs


This second of two parts looks at different memories and possible solutions. Part one can be found here. While various NVM technologies, such as PCRAM, MRAM, ReRAM and NRAM share similar high-level traits, their physical renderings are quite different. That provides each with its own set of challenges and solutions. PCRAM has had a fraught history. Initially released by Samsung, Micron, a... » read more

Week In Review: Manufacturing, Test


Market research The coronavirus pandemic continues to reduce the outlook for worldwide GDP as well as the electronics and IC markets. For example, IC Insights has lowered its IC forecast from 3% to minus 4% in 2020. The IC market is now expected to hit $345.8 billion in 2020, which is $39.0 billion less than the original forecast, which called for an 8% increase this year. Due to the imp... » read more

Week In Review: Design, Low Power


MaxLinear will acquire Intel's Home Gateway Platform Division. MaxLinear, a provider of RF, analog, and mixed-signal ICs, will buy the Home Gateway Platform Division for an all-cash, asset transaction valued at $150 million. The division comprises Wi-Fi Access Points, Ethernet and Home Gateway SoC products deployed across operator and retail markets. The deal is expected to close in the third q... » read more

Week In Review: Auto, Security, Pervasive Computing


COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

Thinking Way, Way Outside The Box


The COVID-19 High Performance Computing Consortium has set records for global cooperation by giant companies, universities and various federal agencies and national laboratories. But it also may have cracked opened a door for much more than that. Until now, there has been a massive race for dominance in the data center. Big companies have gotten rich on data, building infrastructure at a col... » read more

Power Management And Integration Of IPs In SoCs: Part 1


IPs – whether in the form of soft or hard macros – are the epicenter of today’s SoC designs. Integration of IP with low power designs and conducting power aware (PA) verification are always complex and cumbersome. Because most of these IPs are self-contained, pre-verified at the block level, and must be preserved in their totality when integrated or verified at the SoC level. Until UPF... » read more

What’s Holding Back Aging Simulation?


Aging simulation supplies information about the long-term behavior before an IC enters into production, providing an important early evaluation of the reliability required by the application and specification. Re-designs due to reliability issues, and over-design with excessive safety margins, are avoided in this way. In addition, the long-term stability can be demonstrated to the customer. ... » read more

2.5D Architecture Answers AI Training’s Call for “All of the Above”


The impact of AI/ML grows daily impacting every industry and touching the lives of everyone. In marketing, healthcare, retail, transportation, manufacturing and more, AI/ML is a catalyst for great change. This rapid advance is powerfully illustrated by the growth in AI/ML training capabilities which have since 2012 grown by a factor of 10X every year. Today, AI/ML neural network training mod... » read more

IoT Debugging Crosses The Hardware-Software Divide


By Paul Hill and Gordon MacNee Debugging is an important part of embedded design; one that necessarily crosses the hardware/software divide. At a system level, the functionality of an embedded design is increasingly defined by firmware, so avoiding bugs requires engineers with specific disciplines to work closely together during the design phase of a project. It can also mean resisting the u... » read more

Designing Ultra Low Power AI Processors


AI chip design is beginning to shift direction as more computing moves to the edge, adding a level of sophistication and functionality that typically was relegated to the cloud, but in a power envelope compatible with a battery. These changes leverage many existing tools, techniques and best practices for chip design. But they also are beginning to incorporate a variety of new approaches tha... » read more

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