Stop The Drip-Drip-Drip Of Intermittent In-Line Wafer Defects And Increase Your Yields

By Errol Akomer - 23 Oct, 2025 - Comments: 0

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years. Some process engineers call them "slow moving excursions.” And over time, those low-volume defects can add up to significant yield losses. Ignoring a problem Some intermittent process excurs... » read more

New Standardized Semiconductor Cybersecurity Assessment (SSCA) Strengthens Security And Collaboration Across Global Supply Chain

By Alan Weber - 23 Oct, 2025 - Comments: 0

The SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC) Work Group 3 (Supply Chain Cybersecurity) just released a major work product that will have a significant and lasting positive impact on the industry: the “Standardized Semiconductor Cyber Assessment (SSCA)” questionnaire. Creating a common security assessment process for device makers, equipment suppliers, software s... » read more

Why In-Memory Computation Is So Important For Edge AI

By Katherine Derbyshire - 23 Oct, 2025 - Comments: 1

In popular media, “AI” usually means large language models running in expensive, power-hungry data centers. For many applications, though, smaller models running on local hardware are a much better fit. Autonomous vehicles need to respond in real-time, without data transmission delays. Medical and industrial applications often depend on sensitive data that cannot be shared with third par... » read more

Six-Stack Vertically Integrated Hybrid Platform For Large Area Electronics (KAUST, Imperial College Et Al.)

By Technical Paper Link - 22 Oct, 2025 - Comments: 0

A new technical paper titled "Three-dimensional integrated hybrid complementary circuits for large-area electronics" was published by researchers at KAUST, Imperial College London and the University of Manchester. Abstract "The development of low-power computing sectors requires compact, power-efficient and high-performance integrated circuits. Hybrid technology that combines n-type metal o... » read more

Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)

By Technical Paper Link - 22 Oct, 2025 - Comments: 0

A new technical paper titled "DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design" was published by researchers at Intel Corporation, University of California, Santa Barbara and Cadence. Abstract "Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator ... » read more

Multiple Challenges Emerge With Physical AI System Design

By Ann Mutschler - 22 Oct, 2025 - Comments: 0

Physical AI holds the promise of making everything from robots to a slew of mobile edge devices much more interactive and useful, but it will significantly alter how systems are designed, verified, and monitored. Physical AI systems need to work both independently and together. They need the ability to make decisions quickly and locally, typically using much less power than other types of AI... » read more

Blog Review: Oct. 22

By Jesse Allen - 22 Oct, 2025 - Comments: 0

Cadence's Sandip Sadadiya shows what's new in the AMBA AXI Issue L protocol update, which introduces a new credit-based transport mechanism that replaces the traditional VALID/READY handshake, along with improved flow control mechanisms. Siemens' Farhad Ahmed highlights the growing need to do clock domain crossing (CDC) and reset domain crossing (RDC) analysis in a hierarchical way and intro... » read more

Photonics as a Carbon-Sustainable Solution for Next-Gen AI Hardware (Boston Univ., NY CREATES, Lightmatter, Cornell Tech)

By Technical Paper Link - 21 Oct, 2025 - Comments: 0

A new technical paper titled "Photonics for sustainable AI" was published by researchers at Boston University, NY CREATES, Lightmatter and Cornell Tech. Abstract "The rising computational demands of Artificial Intelligence (AI) are driving a rapid surge in carbon emissions from the Information and Communications Technology (ICT) sector. Traditional CMOS-based computing is reaching its scali... » read more

Implementing Power Dynamic Response For Greener AI Data Centers (Univ. of Cambridge, Nyobolt, Nanyang Tech)

By Technical Paper Link - 21 Oct, 2025 - Comments: 0

A new technical paper titled "Improving AI Efficiency in Data Centres by Power Dynamic Response" was published by researchers at University of Cambridge, Nyobolt Limited and Nanyang Technological University. Abstract "The steady growth of artificial intelligence (AI) has accelerated in the recent years, facilitated by the development of sophisticated models such as large language models and... » read more

Modulation of the Inner Gate Length in MFMIS NSFETs To Achieve Big Gains in Memory Window (Samsung, Seoul National Univ.)

By Technical Paper Link - 21 Oct, 2025 - Comments: 0

A new technical paper titled "Inner Gate Length Modulation of MFMIS Nanosheet FET Memory for Advanced Technology Nodes" was published by researchers at Samsung and Seoul National University. Abstract "This work proposes a new way of lowering the area ratio (AR) between the ferroelectric and metal-oxide-semiconductor (MOS) regions of metal-ferroelectric-metal-insulator-semiconductor (MFMIS) ... » read more

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