category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Cryostats Enable Astrophysics Research
By Paul Owen - 11 May, 2021 - Comments: 0

Imagine designing and building two prototype HPD cryostats for the Submillimeter Array on Maunakea in Hawaii. The SMA is a collaborative project between the Smithsonian Astrophysical Observatory (SAO, a member of the Center for Astrophysics | Harvard & Smithsonian) and the Academia Sinica Institute of Astronomy and Astrophysics. The SMA consists of eight radio telescopes operating fro... » read more

Acoustic Metrology for Fine Pitch Microbumps in 3D IC
By Onto Innovation - 11 May, 2021 - Comments: 0

The continuing shift to 3D integration requires formation of electrical interconnects between multiple vertically stacked Si devices to enable high speed, high bandwidth connections. Microbumps and through silicon vias (TSVs) enable the high-density interconnects for die-to-die and die-to-wafer stacking for different applications. In this paper, we present acoustic metrology techniques for the ... » read more

FPGA Prototyping: Supersizing Scale And Performance
By Synopsys - 11 May, 2021 - Comments: 0

Given the cost of re-spinning a system-on-chip (SoC), semiconductor companies have always looked for ways to verify and validate the SoC before tape-out. Prototyping using field programmable gate arrays (FPGAs) became a key methodology as part of this pre-silicon verification and validation effort. Click here to read more. » read more

A Novel Memory Test System With An Electromagnet For STT-MRAM Testing
By Advantest - 11 May, 2021 - Comments: 0

We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm2 in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electroma... » read more

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process
By Guy Cortez - 16 Apr, 2021 - Comments: 0

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

AI In Inspection, Metrology, And Test
By Susan Rambo And Ed Sperling - 06 Apr, 2021 - Comments: 0

AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

Sharing Secure Chip Data For Analytics
By Anne Meixner - 06 Apr, 2021 - Comments: 0

New approaches and standards are being developed to securely share manufacturing and test data across the supply chain, moves that have long been considered critical to the reliability of end devices and faster time to yield and profitability. It will take time before these methods become widespread in the IC supply chain. But there is increasing agreement these kinds of measures are essenti... » read more

How Do Machines Learn?
By Weiyang (Will) Zhou - 06 Apr, 2021 - Comments: 0

We depend, or hope to depend, on machines, especially computers, to do many things, from organizing our photos to parking our cars. Machines are becoming less and less "mechanical" and more and more "intelligent." Machine learning has become a familiar phrase to many people in advanced manufacturing. The next natural question people may ask is: How do machines learn? Recognizing diverse obje... » read more

Monitoring Chips On Many Levels
By Bryon Moyer - 06 Apr, 2021 - Comments: 1

Monitoring is an important trend for optimizing yield, performance, and uptime in systems that use complex integrated circuits, but not all monitoring is the same. In fact, there are multiple levels of monitors. In many cases, they can be used together to help solve problems when something is amiss. They also can be used to help identify who in the supply chain owns the fix. “If the sys... » read more

Security For Cars That Are Smartphones On Wheels
By Taylor Amerding - 06 Apr, 2021 - Comments: 1

Your modern car is a computer on wheels—potentially hundreds of computers on a set of wheels. Heck, even the wheels are infested with computers—what do you think prompts that little light on your dashboard to come on if your tire pressure is low? And computers don’t just run your infotainment system, backup camera, dashboard warning lights, and the voice that tells you to buckle your seat... » read more

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