category: Top Stories

category: Auto, Security & Edge AI

The Challenge Of Defining Worst Case
By Brian Bailey - 14 Nov, 2019 - Comments: 0

Worst case conditions within a chip are impossible to define. But what happens if you missed a corner case that causes chip failure? As the semiconductor market becomes increasingly competitive — startups and systems companies are now competing with established chipmakers — no one can afford to consider theoretical worst cases. Instead, they must intelligently prune the space to make sur... » read more

Speeding Up 3D Design
By Brian Bailey - 14 Nov, 2019 - Comments: 0

2.5D and 3D designs have garnered a lot of attention recently, but when should these solutions be considered and what are the dangers associated with them? Each new packaging option trades off one set of constraints and problems for a different set, and in some cases the gains may not be worth it. For other applications, they have no choice. The tooling in place today makes it possible to de... » read more

Power Complexity On The Rise
By Ann Mutschler - 14 Nov, 2019 - Comments: 0

New chip architectures and custom applications are adding significant challenges to chip design and verification, and the problems are becoming much more complex as low power is added into the mix. Power always has been a consideration in design, but in the past it typically involved different power domains that were either on, off, or in some level of sleep mode. As hardware architectures s... » read more

Addressing Pain Points In Chip Design
By Ed Sperling - 13 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Tricky Tradeoffs For LPDDR5
By Ann Mutschler - 30 Oct, 2019 - Comments: 0

LPDDR5 is slated as the next-gen memory for AI technology, autonomous driving, 5G networks, advanced displays, and leading-edge camera applications, and it is expected to compete with GDDR6 for these applications. But like all next-gen applications, balancing power, performance, and area concerns against new technology options is not straightforward. These are interesting times in the memory... » read more

Pushing Memory Harder
By Brian Bailey - 14 Oct, 2019 - Comments: 4

In an optimized system, no component is waiting for another component while there is useful work to be done. Unfortunately, this is not the case with the processor/memory interface. Put simply, memory cannot keep up. Accessing memory is slow, and it can consume a significant fraction of the power budget. And the general consensus is this problem is not going away anytime soon, despite effort... » read more

Focus Shifts To Wasted Power
By Brian Bailey - 10 Oct, 2019 - Comments: 0

Mobile phones made the industry aware of power, but now the focus is shifting to the total energy needed to perform a task. Activity that is unnecessary to perform the intended task is wasted power, and reducing it requires some new methodologies and structural changes within development teams. There is a broadening awareness about power. "The companies doing SoCs for mobile lead the charge ... » read more

Using Emulators For Power/Performance Tradeoffs
By Ann Mutschler - 10 Oct, 2019 - Comments: 1

Emulation is becoming the tool of choice for power and performance tradeoffs, scaling to almost unlimited capacity for complex chips used in data centers, AI/ML systems and smart phones. While emulation has long been viewed as an important but expensive asset for chipmakers trying to verify and debug chips, it is now viewed as an essential component for design optimization and analysis much ... » read more

Less Margin, More Respins, And New Markets
By Ed Sperling - 10 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

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