category: Top Stories

category: Auto, Security & Edge AI

The Brave New World Of FinFETs
By Ed Sperling - 10 Oct, 2013 - Comments: 0

SoCs using 16nm and 14nm finFETs are expected to begin rolling out next year using a 20nm back-end-of-line process. While the initial performance and power numbers are looking very promising, the challenges of designing and building these complex chips are daunting—and there are more problems on the way. First, the good news. Initial results from foundries show a 150% improvement in perfor... » read more

Power Is A Global Issue
By Brian Bailey - 10 Oct, 2013 - Comments: 0

Power is now the No. 1 target in developing chips. In a keynote speech at the recent Cadence Verification Summit, James “Jim” Hogan—an EDA investor associated with companies such as Sonics, Nimbic, Solido, AutoESL, Altos and many others, and previously part of Cadence’s Telos venture arm—made the point that power is the big problem that needs to be solved. We all know that reducing... » read more

Transient Current Crunch
By Ann Mutschler - 10 Oct, 2013 - Comments: 0

When Intel talks, people listen. So when Intel executive VP Dadi Perlmutter said in a keynote at ISSCC in 2012 that transient power noise was one of the most limiting aspects of the chip design process—and how the package and the board inductance are limiting how low they can take the supply voltage—it showed the gravity of the challenge of effectively managing transient power. Transient po... » read more

On-Chip MCUs Excel At Power Management
By Ann Mutschler - 10 Oct, 2013 - Comments: 0

By Ann Steffora Mutschler When it comes to supplying power to an SoC, there is an increasing trend to make it more intelligent—how to control it more accurately, how it is monitored and how it communicates with different aspects of the chip. Traditional power supply models with analog supplies have less of this control, so a number of engineering teams are considering the use of on-chip m... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 10 Oct, 2013 - Comments: 0

Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate marketing at Atrenta; ... » read more

Flexibility Improves Memory Interface Bandwidth
By Ann Mutschler - 10 Oct, 2013 - Comments: 0

In today’s SoCs, memory is the heart or at least one of the main elements of the design. As such, designing them carefully is paramount to achieving the best bandwidth, performance and power. Performance is very important to be able to access the memory and to trade and store information from different IPs with shared memories or local memories. From the power perspective, every access to... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 04 Oct, 2013 - Comments: 0

By Ed Sperling Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate market... » read more

Power Optimization Requires Higher-Level Thinking
By Ann Mutschler - 12 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler With consumer demand—much of it for power sensitive mobile devices—driving the bulk of semiconductor design activity, it would seem obvious that the way chips are designed would have changed to reflect that. But have they? From an EDA perspective, the term ‘system level’ is used to mean ‘product level’ but this may not be enough, especially when it come... » read more

New Risk Factors For SoCs
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Third-party IP is becoming increasingly important in SoC designs. It saves development time and adds unique value. It also can improve performance and lower power, because a company specializing in IP frequently can build and optimize it better than a company that builds entire chips. But there are also plenty of landmines in IP integration, and there is a growing concern abo... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate market... » read more

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