Micron B47R 3D CTF CuA NAND Die, World’s First 176L (195T)


Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND is one of the most groundbreaking technologies to date, and it is especially for the storage application such as data center, 5G, AI, cloud, intelligent edge, and mobile devices. Mi... » read more

Better Optimization For Many-Core AI Chips


The rise of massively parallel computing has led to an explosion of silicon complexity, driven by the need to process data for artificial intelligence (AI) and machine learning (ML) applications. This complexity is seen in designs like the Cerebras Wafer Scale Engine (figure 1), a tiled manycore, multiple wafer die with a transistor count into the trillions and nearly a million compute cores. ... » read more

Production Testing For Silicon Photonics Wafers


Worldwide data centers and networks for communications currently consume about 8% of the Earth’s total energy produced. To meet the increasing demands for cloud storage, computing, and various emerging applications such as artificial intelligence, genomics revolution, and video transcoding, hyperscale data centers are being built around the world at an accelerated pace, with analysts predicti... » read more

Integrate FPGAs For A Customizable MCU


MCUs come in a broad range of flavors, meaning you can pick the best one for the application with the right performance, feature set, peripherals, memory, and software programmability. So, then, why do many systems also use FPGAs next to the MCUs? Usually, it’s because there’s not a “perfect” MCU for their application. MCUs by definition are built to be generic for a wide variety of app... » read more

Does Your IC Security Need A Renovation?


Five years ago, I moved from Silicon Valley to Gig Harbor, Washington and bought a fixer-upper. As part of my ongoing (and extensive) home renovations, I just finished having the entire exterior redone: roof, siding, paint, masonry, front porch, back deck, outdoor lighting, the works. If you’ve ever embarked on any kind of home remodel project, I don’t have to tell you that the process incl... » read more

RISC-V Verification: The 5 Levels Of Simulation-Based Processor Hardware DV


By Lee Moore and Simon Davidmann The RISC-V open standard ISA (Instruction Set Architecture) offers developers the opportunity to configure the features and functions of a custom processor to uniquely address their target end application needs and requirements. RISC-V has a modular structure with many standard instruction extensions for additional dedicated hardware features such as Floating... » read more

Formally Verifying SystemC/C++ Designs


We’re seeing an increase in the number of designs employing SystemC/C++. This isn’t surprising given the fact that specific use models have emerged to drive common design flows across engineering teams leading to the adoption of high-level synthesis (HLS) at many large semiconductor and electronic systems companies. These HLS tools are a popular method to rapidly generate design components ... » read more

Is RISC-V The Future?


Is RISC-V the future? This is a question that we often get asked, and let’s assume that we mean ‘is RISC-V going to be the dominant ISA in the processor market?’ This is certainly an unfolding situation and has changed significantly in the last five years. RISC-V originated at the University of California, Berkeley, in 2010 and took a number of years to get traction with industry. A bi... » read more

Developing A Real-Time SDR System


As telecommunication technologies evolve there is an on-going drive for the development of high-performance systems for radio communications. Part of that evolution involves implementing components in software functions that had traditionally been implemented in hardware. Software-defined radio (SDR) is a prime example. Significant amounts of signal processing have been handed over to the ge... » read more

Intel/GF deal: Pros, Cons, Unknowns


The industry is still buzzing over a Wall Street Journal report that Intel is in talks to acquire GlobalFoundries (GF) for $30 billion. It’s been a week since the report appeared. Intel is still mum. GF says there are no talks taking place. Regardless, it’s worth looking at all of the possible scenarios just in case, and the pros and cons involved. There are layers upon layers of iron... » read more

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