category: Whitepapers

category: IoT, Security & Automotive

Metrology at Automated Test Equipment Manufacturers
By Advantest - 08 Feb, 2021 - Comments: 0

New technologies require an efficient qualification infrastructure to determine and qualify technical specifications. Metrology is the science which determines the acknowledged specification setting process based on proven international standards. This paper describes metrology and its role and benefits in automated test equipment business. By Piotr Skwierawski and Ralf Haefner. Click her... » read more

Accelerating SoC Verification Closure With Unified Verification Management Solution
By Synopsys - 08 Feb, 2021 - Comments: 0

Functional verification of system-on-chip (SoC) designs requires best-in-class tools linked together in a unified solution in order to address exponential complexity challenges. There is no one-size-fits-all method for verification. Complex designs require a combination of virtual prototyping, static checks, formal analysis, simulation, emulation and FPGA prototyping. The execution of all the t... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities
By Onto Innovation - 08 Feb, 2021 - Comments: 0

Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

Tessent LogicBIST With Observation Scan Technology
By Siemens EDA - 03 Feb, 2021 - Comments: 0

Meeting the ISO 26262 requirements for high quality and long-term reliability mans implementing on-chip safety mechanisms with high defect coverage of IC logic. This paper describes Observation Scan Technology, a new new logic built-in-self-test (BIST) technology that improves logic BIST test quality and reduces in-system test time. Empirical results demonstrate 90% test coverage with up to 10X... » read more

Security In The ARM Ecosystem
By Rambus - 03 Feb, 2021 - Comments: 0

Building security in an SoC aiming to meet the goals set by the ARM Platform Security Architecture (PSA) is a complex matter. This is compounded by the complexity of modern-day SoCs comprising multiple processors, security domains and security levels. The Rambus root of trust provides a solid foundation for the SoC security architecture ticking ‘all the boxes’ for reaching the security goal... » read more

Radix Coverage For Hardware Common Weakness Enumeration (CWE) Guide
By Tortuga Logic - 03 Feb, 2021 - Comments: 0

MITRE's hardware Common Weakness Enumeration (CWE) database aggregates hardware weaknesses that are the root causes of vulnerabilities in deployed parts. A complete list can be found on the MITRE Hardware Design Webpage. Hardware CWEs are ideal to be used alongside internally developed security requirements databases and have been developed and submitted by both government and commercial design... » read more

10 Things You Ought To Know Before You Benchmark Your Software Security Program
By Synopsys - 03 Feb, 2021 - Comments: 0

Benchmarking can help you get a new software security initiative off the ground or better navigate an existing one. It is different from other measurement techniques because it focuses on excellence, includes detailed comparisons, and pools confidential information among numerous organizations. To get you started in the right direction, we’ve put together some quick tips so you get the mos... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Streaming Scan Network
By Siemens EDA - 27 Jan, 2021 - Comments: 0

The increasing complexity in large System on Chip (SoC) designs present challenges to design-for-test (DFT). Hierarchical DFT alleviates some of those challenges, by itself, is no longer enough. Adding Tessent Streaming Scan Network (SSN) technology eliminates the difficult and costly trade-offs between test implementation effort and manufacturing test cost by decoupling core-level and chip-lev... » read more

5G NR Design eMBB
By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

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