Accelerating Electrical Systems Design And Analysis With VeSys


Electrical systems are constantly growing, whether in passenger cars, aircraft or heavy machinery. The growing size and complexity of these systems is driving up development costs and the likelihood of errors, potentially leading to even more cost or damaged brand reputation. New electrical systems and wiring harness engineering solutions implement automation, facilitate collaboration and accel... » read more

Securing SOCs With Esecure HRoT From Silex Insight And Tortuga Logic’s Radix-S


In this new whitepaper, you will learn: How Hardware Roots of Trust (HRoTs) are being used to protect systems with a security foundation The use  of Threat modeling to effectively to verify the eSecure HRoT from Silex Insight in surrounding systems A five-step hardware security validation process that leverages hardware CWEs and Tortuga Logic’s Radix-S to detect and prevent securi... » read more

Mixed-Signal Methodologies: Data Management


Software teams have long used version control and data management systems and they have become an integral part of a software development environment. Practically, no significant software project is started without a software data management system and methodology in place. There are a variety of solutions, typically referred to as Software Configuration Management (SCM) systems, to choose from... » read more

Application Driven Network-on Chip Architecture Exploration & Refinement for a Complex SoC


Peer-reviewed technical journal article from Springer's "Design Automation for Embedded Systems Journal."  Summarizes the various features a NoC is required to implement to be integrated in modern SoCs. Describes a top-down approach, based on the progressive refinement of the NoC description from its functional specification (Sect. 4) to its verification (Sect. 8) Click here to read more. ... » read more

Trust Assurance And Security Verification Of Semiconductor IPs And ICs


Connected autonomous vehicles, 5G networks, Internet-of-things (IoT) devices, defense systems, and critical infrastructure use ASIC and FPGA SoCs running artificial intelligence algorithms or other complex software stacks. Vulnerable or tampered ICs can compromise the safety of people and the confidentiality, integrity, and availability of sensitive information. This paper analyzes the trust an... » read more

Virtual Verification Of Computational Storage Devices


Over recent years, there has been a move to replace hard-disk drive (HDD) storage with solid-state drive (SSD) storage. SDDs are faster, contain no moving parts that can fail or be affected by environmental hazards, and the cost of SSDs has been dropping each year. Unfortunately, the verification of an SSD is quite complex. In particular because of hyperscale datacenter enterprise and client-dr... » read more

Lower Process Nodes Drive Timing Signoff Software Evolution


A dramatic rise in design complexity has led to a slew of new signoff challenges that impact the ability to predictably meet PPA targets. Smaller technology nodes and larger design sizes have caused the number of corners and modes to grow exponentially leading to much longer turnaround times for timing signoff. Moreover, larger design sizes demand huge compute resources for timing signoff. I... » read more

Clarifying Language/Methodology Confusion


Engineers working on modern, large FPGA designs face multiple challenges: changing languages, methodologies and tools implementing them. The fact that many designs now contain both hardware and software only add to the confusion. This document tries to clarify the situation. Click here to read more. » read more

Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver


Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and FDTD), due to the complexity in the 3D designs.... » read more

Side Wettable Flanks For Leadless Automotive Packaging


The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

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