category: Whitepapers

category: IoT, Security & Automotive

Usage Of Pulse-Edge Transformer In Secondary-Controlled Flyback Applications
By Infineon - 01 Nov, 2023 - Comments: 0

As the demand for smaller form factors and higher energy efficiency for charger/adapter grows, the wide bandgap (WBG) device technology is gaining popularity. To use the potential of WBG and thus improve the power density and efficiency, the switching frequency levels of converters are in the order of 300 kHz to 400 kHz. The higher switching frequency also requires faster control or response ti... » read more

Selective Radiation Mitigation For Integrated Circuits
By Siemens EDA - 25 Oct, 2023 - Comments: 0

Shortened lifecycles and cost reduction coupled with the demand for advanced capabilities continue to challenge project teams delivering IC into space systems. To meet these demands, project teams must continue to evolve across all aspects of the lifecycle, including the implementation and verification of mitigation protections against single event effects. This paper defines a methodology t... » read more

FIR And Median Filter Accelerators In CodAL
By Codasip - 25 Oct, 2023 - Comments: 0

5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G) which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable mul... » read more

ESD Co-Design For 224G And 112G SerDes In FinFET Technologies
By Synopsys - 25 Oct, 2023 - Comments: 0

In addressing the challenges of enhancing ESD resilience for high-speed SerDes interfaces, it's crucial to ensure the implementation of appropriate ESD protection measures. This is particularly vital during the device's lifecycle from the conclusion of silicon wafer processing to system assembly, a phase during which electronic devices are highly susceptible to Electrostatic Discharge (ESD) dam... » read more

Five Strategies To Accelerate 5G Device Development
By Keysight - 25 Oct, 2023 - Comments: 0

Designing and implementing 5G devices in new mmWave operating bands present new challenges. New technologies and evolving standards increase design complexity. Here are five strategies to help you address these challenges and get your designs to market faster. Click here to read more. » read more

Why A DSP Is Indispensable In The New World of AI
By Cadence - 25 Oct, 2023 - Comments: 0

Chips being designed today for the automotive, mobile handset, AI-IoT (artificial intelligence - Internet of things), and other AI applications will be fabricated in a year or two, designed into end products that will hit the market in three or more years, and then have a product lifecycle of at least five years. These chips will be used in systems with a large number and various types of senso... » read more

Negative-Tone Photosensitive Polymeric Bonding Material To Enable Room Temperature Prebond For Cu/Polymer Hybrid Bonding
By Brewer Science - 18 Oct, 2023 - Comments: 0

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg≤100∘C ; Young’s modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when... » read more

AI Process Control Platform Enabling Next Generation Technology, Part 2
By Tignis - 18 Oct, 2023 - Comments: 0

As feature dimensions in semiconductors continue to shrink and worldwide demand continues to expand, semiconductor equipment manufacturers need innovative ways to compete and deliver. The Tignis PAICe Maker physics-driven AI computational modeling platform accelerates leading-edge semiconductor manufacturing—from equipment R&D to reliable high-yield chip fabrication capability. Tignis sup... » read more

Survey: 2023 eBeam Initiative Luminaries Survey Results
By eBeam Initiative - 18 Oct, 2023 - Comments: 0

Luminaries are confident in high-NA EUV and curvilinear masks 12th Annual Luminaries Survey — July 2023 • Luminaries remain confident in broad High-NA EUV adoption by 2028 • Confidence doubled in leading-edge mask shops handling curvilinear mask demand • Curvilinear masks aren’t just for EUV • Luminaries are more confident about 2023 mask revenues than SEMI Click here to rea... » read more

The Value Of Field Solvers In Semiconductor Development Helps Drive Infineon Innovation
By Siemens EDA - 11 Oct, 2023 - Comments: 0

Parasitic extraction (PEX) helps ensure accurate circuit performance in the design and verification flow. Development of accurate PEX runsets depends on accurate and precise extraction results obtained using a full-featured field solver. Infineon selected the Calibre xACT 3D tool as their reference field solver tool of choice in the development of their next-generation semiconductor power produ... » read more

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