category: Whitepapers

category: IoT, Security & Automotive

Driving Performance In GaN-Based USB-C Adapters And Chargers With EPR
By Infineon - 03 May, 2023 - Comments: 0

With the announcement of the USB PD 3.1 standard [1], higher power levels of up to 240 W are enabled. Still, the wide output voltage range from 5 V to 48 V raises new challenges for the converter topologies currently in use. In this white paper, the combination of an AC-DC PFC boost and a DC-DC hybrid flyback (HFB) stage [2], also well known as asymmetrical half-bridge flyback topology, is prop... » read more

Pre-Layout, Post-Layout Circuit Reliability
By Siemens EDA - 26 Apr, 2023 - Comments: 0

With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff verification to check design reliability is no longer practical for design teams. Designers must now apply reliability verification checks throughout the design flow, from intellectual property (IP) level to full-chip level, to ensure they meet tapeout schedules while confirming design reliability... » read more

Impacts Of Process Flow, Scaling, And Variability On Interconnect Performance
By Lam Research - 26 Apr, 2023 - Comments: 0

Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three different process flows: single damascene, dual damascene, and semi-damascene (subtractive metal etch). The effects of process variation for the three flows are also investigated to determine the relativ... » read more

Meeting The Major Challenges Of Modern Memory Design
By Synopsys - 26 Apr, 2023 - Comments: 0

Memory lies at the heart of every electronics application, and demand is growing all the time. Users want ever greater capacity, throughput, and reliability. At the same time, time to market (TTM) goals and competitive pressures mandate that memories be developed in ever shorter project schedules. These requirements put enormous pressure on designers of discrete memory chips, memory dies in 2.5... » read more

Automated HW/SW Co-Design Of DSP Systems Composed Of Processors And Hardware Accelerators
By Cadence - 26 Apr, 2023 - Comments: 0

Seemingly overnight, data acquisition and digital signal processing have gone from a hidden background function in special purpose-built subsystems, such as PC graphics cards and airborne missile guidance systems, to the foreground in the form of in-ear IoT devices, smartphones, and autonomous vehicles. As the number of smart data-acquisition devices grows, so does the amount of data requiring ... » read more

Nanophotonic Sensor Implants With 3D Hybrid Periodic-Amorphous Photonic Crystals For Wide-Angle Monitoring Of Long-Term In-Vivo Intraocular Pressure
By Samsung - 19 Apr, 2023 - Comments: 0

In this work, we have developed a nanophotonic-based optomechnical device and reported the smallest intraocular pressure (IOP) implant (Dia: 500 um, Thick: 200 um) that can be placed in any area under the cornea into the anterior chamber without touching the endothelium. The sensor is made of only flexible biocompatible silicone/polydimethylsiloxane (PDMS) and structured as 3D hybrid photonic c... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices
By Promex Industries - 19 Apr, 2023 - Comments: 0

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Click here to read more. » read more

Deployment Of A 5G Network Testbed To Support Drone Operations
By MITRE ENGENUITY - 19 Apr, 2023 - Comments: 0

In this paper, the MITRE Engenuity Open Generation 5G Consortium describes efforts related to the recent deployment of our first outdoors 5G private testbed, designed to support experimentation with drone operations. We also present early results obtained from the initial assessment of command and control (C2) link performance over this network. Click here to read more. » read more

Effective Resource Utilization In PCIe Gen6: Shared Flow Control
By Siemens EDA - 12 Apr, 2023 - Comments: 0

In PCIe 6.0, the data rate has doubled from 32 GT/s to 64 GT/s. This technology is a cost-effective and scalable interconnect solution that will continue to impact data-intensive markets and applications while maintaining backward compatibility with all previous generations of PCIe. Data-intensive uses include data centers, artificial intelligence/machine learning computing, high-performance co... » read more

Simulation Solutions For Aviation: Hybrid-Electric Propulsion Systems
By Ansys - 12 Apr, 2023 - Comments: 0

The commercial aviation industry is facing the total transformation of aircraft propulsion in the coming decades. As manufacturers develop more sustainable propulsion systems and strive to reduce the environmental impact of commercial aircraft, they must design products optimized for performance and safety. Commercial aviation companies can use digital engineering solutions to do exactly that. ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy