Accelerating Software Development With Fast Virtual Prototypes


Most of today's largest semiconductor devices are highly complex system on chip (SoC) designs, which means that they include one or more embedded processors. This indicates that software provides some of the key functionality of the chip. The system cannot be fully verified or validated without both hardware and software. However, software development generally takes more time and resources to ... » read more

Components And Tools for Functional Safety Applications


Functional safety is important across a variety of markets, including the automotive, industrial, medical, and railway sectors, and often prevalent in consumer electronics. However, the complexity of the embedded software required for functional safety is growing and security issues are rising due to connectivity requirements. This can result the failure of a safety-critical system and lead to ... » read more

High-Tech: Innovation At The Speed of Light


As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

AI Goes Ultra Low Power — Part 1


Based on the concept of the new Federal Agency for Jump Innovations (PSRIN-D), the BMBF initiated three pilot innovation competitions. One of them presented the participants with the task of developing the most energy-efficient AI system possible as a hardware implementation on an ASIC or FPGA. With this, a stack of hundreds of two-minute long ECG signals should be analyzed with a minimum of en... » read more

HyperRAM As A Low Pin-Count Expansion Memory For Embedded Systems


Rapid advances in microelectronics are driving mega trends across industries, creating a need for new technologies and optimized devices with better performance. With large volumes of data being made available due to the increasing content of electronics in automotive, industrial, smart home and IoT devices, there is a requirement to seamlessly process and render information. Application platfo... » read more

High-Quality Test And Embedded Analytics For Secure Applications


Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more

Increasing IP And SoC Debug Efficiency 10X With Intelligent Waveform Reuse


Design and verification reuse lies at the very heart of every modern chip development effort. A system on chip (SoC) project with billions of gates cannot possibly be completed in reasonable time without leveraging blocks from prior projects and commercial intellectual property (IP) offerings. These reused blocks are themselves challenging to develop since they are as large and complex as previ... » read more

Supply Chain Security And Counterfeit Detection Using UCT


The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put the spotlight on the growing concern of fraudulent or counterfeited integrated circuits (ICs). Proteus deep data analytics based on Universal Chip Telemetry (UCT) provides a new approach to supply chain ... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing


This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

Large-Field, Fine-Resolution Lithography Enables Next-Generation Panel-Level Packaging


The lithography challenge for large heterogeneous integration is the limited size of the exposure field (typically 60mm x 60mm or less) for most currently available lithography systems. Fine resolution and a large field size provide the user with the opportunity to increase the package size beyond 150mm x 150mm and maintain high throughput. This new capability has the potential to pave the ... » read more

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