category: Whitepapers

category: IoT, Security & Automotive

A New World Of Innovation
By Synopsys - 04 May, 2022 - Comments: 0

There has been a fundamental shift in product innovation. Not merely a revolution in materials or design, but a revolution of possibilities. Advanced software technologies such as artificial intelligence have given us a peek of what could be, enabled by methods to deliver the speed that turn worldchanging ideas into reality. We’ve now reached an event horizon — one where semiconductors and ... » read more

System-Level Benefits Of The Versal Platform
By AMD - 04 May, 2022 - Comments: 0

Moore's Law has fueled the technological prosperity of the last 50 years, but it is generally believed now that Gordon Moore's 1965 forecast about the pace of innovation no longer holds true today. Continuing the silicon architectures of yesterday cannot meet the expanding demands of tomorrow's workloads. Frequently highlighted by today’s leaders in the field of computer architecture [Ref 1],... » read more

EZ-PD PMG1 High Voltage MCU As A Coprocessor For Embedded Applications
By Infineon - 04 May, 2022 - Comments: 0

EZ-PD™ PMG1, a family of High Voltage Microcontrollers (MCUs) with USB-C Power Delivery (PD), supports embedded firmware engineers and system designers to adopt USB-C into applications such as smart speakers, IoT hubs, home appliances, internet gateways, power and garden tools. This article targets embedded firmware engineers and system designers interested in including USB-C in their em... » read more

Arm’s Input Qualification Methodology Using PowerPro
By Siemens EDA - 27 Apr, 2022 - Comments: 0

This white paper proposes a new automated input qualification methodology that Arm developed using Siemens EDA’s PowerPro software portfolio that performs various data integrity checks at the IC design build and prototype stage. This methodology ensures in quicker iterations that input data are high fidelity, leading to a well correlated power numbers. Should multiple iterations be necessary,... » read more

4 Tips For 5G New Radio Signal Creation
By Keysight - 27 Apr, 2022 - Comments: 0

5G NR requires you to think differently about how you design and test devices. Learn the four tips to help you successfully generate 5G NR test signals to get your designs to market faster. Click here to read more. » read more

Semiconductor Scaling Is Failing — What Next For Processors?
By Codasip - 27 Apr, 2022 - Comments: 0

This in-depth paper looks at the changing dynamics in the semiconductor industry. In other words, why many companies are looking to customize their processor designs to keep pace with software and system demands. It goes onto highlight the opportunities available to companies of all sizes, in seeking to differentiate and specialize their processor designs. Click here to read more. » read more

Advances In EM Analysis And Design Flows For RF System Development
By Cadence - 27 Apr, 2022 - Comments: 0

With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Streamlining Vehicular Electrical System Design And Verification
By Synopsys - 27 Apr, 2022 - Comments: 0

Automobiles and other road vehicles such as trucks and buses have always been one of the most demanding applications for mechanical and electrical design. Systems must operate properly over a wide range of environmental conditions, facing extremes of temperature, humidity, sunlight, dirt, vibration and more. User expectations of reliability and availability mandate safety-critical design practi... » read more

Vehicle Electrification Driving Supply Chain Evolution
By Amkor - 20 Apr, 2022 - Comments: 0

Dr. Ajay Sattu, Director, Automotive Product Marketing, Amkor Technology, Inc. If the recently concluded CES 2022 is any indication, the automotive industry is yet again in the cross hairs of both consumers and industry experts alike. Whether it’s the new electric vehicle (EV) model introductions, color changing technologies, or concept cars, automotive companies are slowly transforming th... » read more

A Single-Layer Mechanical Debonding Adhesive For Advanced Wafer-Level Packaging
By Brewer Science - 20 Apr, 2022 - Comments: 0

Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore's law has provided a very well-defined relationship between performance and cost and the semiconductor industry has followed this law for the past several decades with no issue. However, it became more and more difficult for foundries and integrated device manufacturers (IDMs) to scale to ... » read more

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