category: Whitepapers

category: IoT, Security & Automotive

High-Quality Test And Embedded Analytics For Secure Applications
By Siemens EDA - 05 Jan, 2022 - Comments: 0

Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more

Radar Systems
By Cadence - 05 Jan, 2022 - Comments: 0

Combined with advances in phased-array antennas and integration technologies, radars are moving beyond military/aerospace markets to address a host of commercial applications. This white paper showcases how the Cadence AWR Design Environment platform provides designers with a host of modeling and simulation technologies needed to meet the challenges of all types of radar system design. Click h... » read more

Reinventing Traceability
By Arteris - 05 Jan, 2022 - Comments: 0

This paper written by Vincent Thibault of Arteris IP describes semiconductor industry-specific problems with establishing and automating traceability between the disparate systems design teams use for requirements, specification, EDA, software engineering, verification, documentation and support. It proposes and explains the Arteris Harmony Trace solution which: Increases system quality... » read more

Safe And Reliable MOSFET Operation In Bidirectional Power Switch (BDPS) Applications
By Infineon - 05 Jan, 2022 - Comments: 0

The global market for battery-powered applications is rapidly growing, including power tools, service robots, light electric vehicles, and many others. The evolution of switched-mode power supply (SMPS) topologies enables designers to ensure safe charging and discharging of the equipment’s battery using bidirectional converters through the same terminal. However, to meet the safety requiremen... » read more

Hardware Root of Trust: Everything You Need To Know
By Rambus - 05 Jan, 2022 - Comments: 0

As explained in our “Secure Silicon IP Webinar Series“, a root of trust is the security foundation for an SoC, other semiconductor device or electronic system. However, its meaning differs depending on who you ask. For example, the hardware root of trust contains the keys for cryptographic functions and is usually a part of the secure boot process providing the foundation for the software c... » read more

Taking 2.5D/3DIC Physical Verification To The Next Level
By Siemens EDA - 21 Dec, 2021 - Comments: 0

As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can use Calibre 3DSTACK physical verification checks to verify die alignments for proper connectivity and electrical behavior. The Calibre 3DSTACK precheck mode enables design teams to find and correct basic implementation mistakes ... » read more

Holistic FMEDA-Driven Safety Design And Verification For Analog, Digital, And Mixed-Signal Design
By Cadence - 21 Dec, 2021 - Comments: 0

With state-of-the-art electronics propelling the automotive industry into the future, automotive OEMs require safety-certified semiconductors. The integration of these advanced technologies into cars drives a need for component suppliers to assess and audit the risk of the technologies they want to deploy. At the same time, safety requirements are constantly evolving and becoming more stringent... » read more

Flexible USB4-Based Interface IP Solution For AI At The Edge
By Synopsys - 21 Dec, 2021 - Comments: 0

Consumers have become accustomed to smart devices that are powered by advances in artificial intelligence (AI). To expand the devices’ total addressable market, innovative device designers build edge AI accelerators and edge AI SoCs that support multiple use cases and integration options. This white paper describes a flexible USB4-based IP solution for edge AI accelerators and SoCs. The IP so... » read more

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications
By Brewer Science - 15 Dec, 2021 - Comments: 0

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using through-silicon vias (TSVs). The materials used to achieve TB and DB are extremely critical and the industry's current best practice is the use of tw... » read more

The Physics Of Ports And Associated Ground For EM Simulators Serving RF Designs
By Cadence - 09 Dec, 2021 - Comments: 0

The use of ports in electromagnetic (EM) simulators has evolved and matured over the years to make real-world design simulations practical. Having a foundational understanding of ports provides an intuitive skill in their proper selection and use in conjunction with circuit simulation. In this white paper, we examine ports common to EM simulators, which are the most common simulators for microw... » read more

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