category: Whitepapers

category: IoT, Security & Automotive

Durability And Cost Benefits Drive Mil-Aero Demand For OCPP
By QP Technologies - 20 Apr, 2022 - Comments: 0

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They are able to withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t o... » read more

Yield Enhancement By Virtual Fabrication
By Coventor - 20 Apr, 2022 - Comments: 0

This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specifica... » read more

Automated DRC Voltage Annotation Provides Faster And More Accurate Verification For Voltage-Aware Spacing Rules
By Siemens EDA - 13 Apr, 2022 - Comments: 0

Accurate and repeatable reliability verification is now essential for both advanced node designs and the increasingly complex products being produced at established nodes. To ensure compliance with all process, reliability, and power management requirements, voltage-aware DRC applies variable spacing requirements, based on either the absolute voltage or delta voltage values, to accurately evalu... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 13 Apr, 2022 - Comments: 0

By Martin James, Gary Dick, and Arif Khan, Cadence with Suhas Pai and Brian Rea, Intel The Compute Express Link™ (CXL™) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, ... » read more

Key Applications For In-Chip Monitoring IP
By Synopsys - 13 Apr, 2022 - Comments: 0

The latest SoCs on advanced semiconductor nodes especially FinFET, typically include a fabric of sensors spread across the die and for good reason. But why and what are the benefits? This article explores some of the key applications for In Chip monitoring and why embedding In Chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a combination of... » read more

A Full-GaN Solution For High Power Density Chargers And Adapters
By Infineon - 13 Apr, 2022 - Comments: 0

Due to continuous demand for high power density, USB-C fast chargers’ switching frequencies need to be increased to reduce the size of the transformers and the filter components. Emerging technologies based on Wide Band Gap (WBG) semiconductor materials enable new approaches to increase power density. At high switching frequencies, GaN HEMTs for synchronous rectifier (SR) switches have the ad... » read more

Automation Of Shared Bus Memory Test With Tessent MemoryBIST
By Siemens EDA - 12 Apr, 2022 - Comments: 0

New requirements in automotive, artificial intelligence (AI), and processor applications have resulted in increased use of memory-heavy IP. Memory-heavy IPs for these applications are optimized for high performance, and they will often have a single access point for testing the memories. Tessent MemoryBIST provides an out-of-the-box solution for using this single access point, or shared bus int... » read more

Case Study — 3D Wire Bond Inspection and Metrology
By CyberOptics - 12 Apr, 2022 - Comments: 0

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Extracting Intrinsic Mechanical Properties Of Thin Low-Dielectric Constant Materials With iTF Analysis
By Bruker - 12 Apr, 2022 - Comments: 0

This white paper focuses on the optimization and use of Bruker’s iTF software package for the extraction of intrinsic (substrate independent) mechanical properties, particularly for thin, low-k materials. These considerations are split into two main parts: Measurement procedure (Section II) and iTF execution (Section III). The former outlines important aspects of acquiring proper experimental... » read more

Made in the Cloud!
By Synopsys - 12 Apr, 2022 - Comments: 0

While software developers have been building and delivering software in the cloud for many years now, how much IC hardware is “made in the cloud”? We’re here to help you understand the case for IC hardware development in the cloud and answer the most common questions. Download the paper and learn: Why isn’t everybody doing it? Why cloud? Why now? Can you afford to ignore i... » read more

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