category: Whitepapers

category: IoT, Security & Automotive

How Safety Requirements For Autonomous Vehicles Will Reinvent Fuse And Relay Boxes In Automotive Power Distribution
By Infineon - 09 Dec, 2021 - Comments: 0

Open up the bonnet of any modern automobile and many of us would be hard-pressed to find anything that we could fix ourselves. With pipes and cables almost artistically integrated into the engine bay, and sleek plastic covers fitted everywhere, there is very little that can still be recognized, yet alone repaired. Perhaps the only location where we feel comfortable is the “fuse box”, or pow... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

Simulation Workflow For Efficiency Calculation Of A High-Performance Electric Powertrain
By Ansys - 08 Dec, 2021 - Comments: 0

In battery electric vehicles the efficiency of the powertrain has a big impact on driving range and performance. As the overall efficiency of the electric powertrain is typically more than 90%, further optimization is challenging. Especially in high-performance electric vehicles, the efficiency over one or multiple laps on a racing track is crucial. It requires accurate estimation of power loss... » read more

Design Meets EDA: Gaps And Countermeasures In Analog/Mixed-Signal IC Design
By Fraunhofer IIS/EAS - 08 Dec, 2021 - Comments: 0

Along the path from specification to silicon, the design of analog/mixed-signal chips comprises a variety of challenges. They are of technological, methodological, organizational, communicational, and business nature. Additionally, large gaps are to be managed among the individual challenges. Still up to now, approaches such as the “four eye principle” are used even in industrial practice i... » read more

Arm Neoverse N1 Core: Performance Analysis Methodology
By Arm - 08 Dec, 2021 - Comments: 0

The Arm Neoverse ecosystem is growing substantially with many Arm hardware and software partners developing applications and porting their workloads onto Arm-based cloud instances. With Neoverse N1 based systems becoming widely available, many real-world workloads are showing very competitive performance and significant cost savings when compared to legacy systems. Some recent examples include:... » read more

Scaling Processor Performance And Safety To Meet Requirements For Next-Generation Safety-Critical Automotive Designs
By Synopsys - 08 Dec, 2021 - Comments: 0

This white paper proposes a state-of-the-art processor architecture targeting automotive safety systems that meets the requirements of such active safety systems delivering the required processing performance, providing the highest automotive safety integrity level (ASIL) while also significantly contributing to a reduction in overall cost of the systems through the use of artificial neural net... » read more

Streaming Scan Network: An Efficient Packetized Data Network For Testing Of Complex SoCs
By Siemens EDA - 07 Dec, 2021 - Comments: 0

Originally presented at the 2020 International Test Conference by Siemens and Intel authors, this paper describes the Tessent Streaming Scan Network technology and demonstrates how this packetized data network optimizes test time and implementation productivity for today’s complex SoCs. The author-submitted version of the IEEE paper is reprinted here with permission. Authors: Jean-Françoi... » read more

Case Study — Deep Learning For Corner Fill Inspection And Metrology On Integrated Circuits
By CyberOptics - 07 Dec, 2021 - Comments: 0

CyberOptics utilized deep learning to accurately inspect the corner fill on integrated circuits (ICs) produced by a large memory supplier. Traditional methods of inspection showed limitations in their ability to entirely detect the presence and absence of fill, indicating that a more advanced approach was necessary. CyberOptics drew on its large pool of algorithm and neural network expertise to... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging
By Onto Innovation - 07 Dec, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Effectively Addressing The Challenge Of Securing Connected And Autonomous Vehicles
By Siemens EDA - 01 Dec, 2021 - Comments: 0

Vehicles are becoming the most sophisticated connected objects in the ‘Internet of Things’. As vehicles integrate functionality that will enable a fully autonomous future, the attack surface grows substantially. Combined with remote connectivity at multiple points, the clock is ticking in a race to improve cybersecurity in all types of vehicles to ensure that all stakeholders, but particula... » read more

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