category: Whitepapers

category: IoT, Security & Automotive

Traction Inverters Are A Key Application For Electrified Vehicle Designs
By Infineon - 01 Dec, 2021 - Comments: 0

High efficiency increases range and reduces cooling efforts while optimized power density assists with space and weight. As sales volumes increase, the focus is shifting to automated manufacturing with increasing quality requirements. The most fundamental system in all electric vehicles is the powertrain and, at the heart of this is the traction inverter that converts energy stored in the ba... » read more

Anti-Tamper Benefits Of Encrypted Helper-Data Images For PUFs
By Rambus - 01 Dec, 2021 - Comments: 0

PUFs are mixed-signal circuits which rely on variations unique to a specific chip to self-generate a digital “fingerprint.” Most PUFs require a “helper-data” image that is generated during the initial digitization process, also known as Enrollment. Leveraging the chip-unique transformation function of PUFs and encrypted helper data, an unclonable challenge-response mechanism can be impl... » read more

Importance Of Programmability In Next-Generation Security Appliances
By Xilinx - 01 Dec, 2021 - Comments: 0

Traditional methods of deploying network security through software-based firewalls do not scale because the latency and bandwidth requirements cannot be addressed. The flexibility and configurability of Xilinx adaptive devices combined with IP and tool offerings significantly improves security processing performance. This white paper explores multiple firewall architectures, which include so... » read more

Securing Connected Medical Devices For FDA Submissions
By Synopsys - 01 Dec, 2021 - Comments: 0

The benefits and challenges of the Internet of Things (IoT) are especially evident in healthcare, thanks to increases in the volume and use of medical devices. Network-connected devices have greatly improved patient care by helping healthcare providers monitor vital signs, regulate medication dosages, improve diagnostics, and ultimately improve patient outcomes while lowering costs. This whi... » read more

Raising The Bar With The Next Generation Of AI For Chip Design
By Synopsys - 22 Nov, 2021 - Comments: 0

The semiconductor industry is enjoying renewed growth despite chip shortages plaguing everything from cars to kitchen appliances. But while the chips themselves continue to get faster and smarter, the chip design process itself hasn’t changed that much in 20+ years. It typically takes 2-3 years to design a chip with a large engineering team and tens or hundreds of millions of dollars to get a... » read more

Batch Filters: A Better, Faster Way To Filter Large DRC Results Databases
By Siemens EDA - 22 Nov, 2021 - Comments: 0

Reviewing massive DRC results databases (RDBs) can be a time-consuming stage in traditional debug flows, due primarily to the loading, filtering, and display times associated with these large datasets. Finding the most effective approach to filtering results data is important to optimize both results debug time and resource usage. While smaller databases that load quickly in GUI applications ca... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 22 Nov, 2021 - Comments: 0

The Compute Express Link (CXL) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, and hyperscale applications, with specific use cases in newer memory architectures such as disaggregated a... » read more

Chemistry Working For Lithography: The Marangoni-Effect-Based Single Layer For Enhanced Planarization
By Brewer Science - 17 Nov, 2021 - Comments: 0

In the field of semiconductor manufacturing, there is still a continuous search for techniques to improve the Critical Dimension Uniformity (CDU) across the wafer. CDU improvement and general defectiveness reduction increase the industrial yield and guarantee high reliability standards. In the KrF Dual-Damascene module integration, at a lithographic level, deep trench planarization is mandatory... » read more

Heterogeneous Integration Using Organic Interposer Technology
By Amkor - 17 Nov, 2021 - Comments: 0

As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packages will still be around, the high-end market is shifting towards multiple-die packages to reduce overall costs and improve functionality. This shif... » read more

Semiconductor Manufacturing Equipment And Measures To Protect The Earth’s Environment
By TEL - 17 Nov, 2021 - Comments: 0

Over the years, many countries on our planet have made significant efforts to develop their economies, achieving remarkable advancements in a wide variety of industries. However, the progress came with a great cost to the Earth’s environment. The destruction of nature has occurred frequently as a matter of course, to such an extent that in some regions it would hardly be possible to restore n... » read more

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