System Innovation For Aerospace, Defense And Government


Tools for developer and user challenges Performance in a small package — low size, weight and power (SWaP) Long-life and upgradability with high-reliability, security, and safety Reliability in a range of operating environments, from ground to space End-to-end support: from the IoT network edge to the datacenter Process massively parallel sensor data with low latency S... » read more

Embedded AI On L-Series Cores


Over the last few years there has been an important shift from cloud-level to device-level AI processing. The ability to run AI/ML tasks becomes a must-have when selecting an SoC or MCU for IoT and IIoT applications. Embedded devices are typically resource-constrained, making it difficult to run AI algorithms on embedded platforms. This paper looks at what could make it easier from a softwar... » read more

Survey: 2022 Deep Learning Applications


The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Comparing Formal And Simulation Code Coverage


There is a difference in semantics between code coverage generated from a simulator engine and code coverage generated from a formal engine. This paper seeks to raise the awareness of verification engineers on how best to make use of the code coverage data generated by different verification engines. The paper lays out the reasons for using code coverage and describes how simulation code covera... » read more

Advancing Electric Vehicle Battery Characterization By Integrating Drive Cycle On Cooling Impacts


Battery powered electric vehicles (EVs) and hybrid electric vehicles (HEVs) have been gaining market share as the public’s environmental concerns drive the demand for better fuel efficiency. Apart from the need to improve the mileage one can drive before recharging, battery reliability is another major concern. Effective cooling in intense charge/discharge conditions is crucial to minimizi... » read more

Navigating The Intersection Of Safety And Security


Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

A Framework For Ultra Low-Power Hardware Accelerators Using NNs For Embedded Time Series Classification


In embedded applications that use neural networks (NNs) for classification tasks, it is important to not only minimize the power consumption of the NN calculation, but of the whole system. Optimization approaches for individual parts exist, such as quantization of the NN or analog calculation of arithmetic operations. However, there is no holistic approach for a complete embedded system design ... » read more

Improving Performance And Simplifying Coding With XY Memory’s Implicit Parallelism


Instruction-level Parallelism (ILP) refers to design techniques that enable more than one RISC instruction to be executed simultaneously in the same instruction, which boosts processor performance by increasing the amount of work done in a given time interval, thereby increasing the throughput. This parallelism can be explicit, where each additional instruction is explicitly part of the instruc... » read more

Weaving Digital Threads Into A Global Fabric Of Enterprise Knowledge


How smart manufacturing software provides visibility and control of all phases of the semiconductor manufacturing process. Run-to-run (R2R) automated process control gathers critical data from each production run and automatically adjusts process parameters for the next run based on sophisticated models of process performance. Click here to read more. » read more

Advanced High Throughput e-Beam Inspection With DirectScan


Optical inspection cannot resolve critical defects at advanced nodes and cannot detect subsurface defects. Especially at 7nm and below, many yield and reliability killer defects are the result of interactions between lithography, etch, and fill. These defects often will have part per billion (PPB) level fail rates. Conventional eBeam tools lack the throughput to measure PPB level fail rates. A ... » read more

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