High-Fidelity Noise Prediction for Aerospace and Automotive Industries


Accurate noise prediction is essential for designing quieter, more efficient aircraft and vehicles. However, traditional experimental methods are often expensive, time-consuming, and limited in scope. This white paper outlines how an advanced computational tool leverages large-eddy simulations (LES) to deliver accurate, cost-effective aeroacoustics simulations. Key Takeaways: Advance... » read more

The Xpedition Flow


Comprehensive approach to designing electronics The complexities of modern PCB design necessitate a comprehensive approach that integrates various aspects of the entire design through manufacturing flow. The ideal design flow requires seamless cooperation and synergy across various domains, including electrical, mechanical, software, systems, test, and manufacturing. Xpedition provides a gr... » read more

Why Silicon IP Has Become the Foundation of Modern SoC Design


Addressing challenges of using silicon IP, tracking IP cores, and taking advantage of the flexibility of modular design requires a proven process. It also requires a state-of-the-art IP management system and modular design roadmap that will lead to success in silicon. Keysight has identified 6 steps to effective IP management based on best practices and customer experiences. Read more here. » read more

Package Assembly Design Kits (PADK) Benefits For Packaging Design Engineers


A new IEEE technical paper titled "Package Assembly Design Kits (PADK's)- The Future of Advanced Wafer-Level Manufacturing" was written by researchers from Amkor. Find the technical paper here. September 2024. "Although package design and IC design are two different worlds, they share several key similarities that have contributed to the successful use of Package Assembly Design Kits (PAD... » read more

Accelerating Verification Of Computational Storage Designs Using Avery NVMe Verification IP


Computational storage is an emerging paradigm that integrates processing capabilities directly within storage devices. This paper outlines how this approach addresses the limitations of traditional NVM Express (NVMe) SSDs and the performance characteristics of the newly introduced compute and subsystem local memory (SLM) namespaces. The paper also focuses on the verification framework provided ... » read more

A Comprehensive Guide to Understanding AI Inference on the CPU


As AI continues to revolutionize industries, new workloads, like generative AI, inspire new use cases, the demand for efficient and scalable AI-based solutions has never been greater. While training often garners attention, inference—the process of applying trained models to new data—is essential for AI workloads, whether they are running in the cloud, or enabling real-world applications at... » read more

How to Accelerate Multiphysics Simulation Software with Turnkey Hardware Systems


Complicated problems take longer to solve. In engineering, it’s a given that simulation drastically accelerates the development cycle, enabling engineers to digitally test ideas and optimize products exponentially faster than physical testing. However, today’s complex products and systems require simulation of many different physics—the thermal, structural, and electromagnetic forces in a... » read more

Chiplets for Future Automotive Application


Abstract Autonomous vehicles and associated ADAS systems are driving vehicle electronics content to unprecedented levels. These systems require significant processing power via a centralized system. Chiplets are one solution to distribute functionality on different technologies and can help to secure the supply chain and reduce rising development costs in advanced IC nodes. This traditionally ... » read more

Innovate Faster with A Multi-Die Solution


The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package. While multi-die design is the solution, it also introduces se... » read more

Outsmarting Silent Data Corruption In AI Processors With Two-Stage Detection


Silent data corruption is on the rise following advancements in semiconductor technology. The explosion in AI for speech, image, video, and text processing leads to a growing complexity and diversity of hardware systems, bringing an increased risk to data integrity. SDC rate is much higher than software engineers expect, undermining the hardware reliability they used to take for granted. Rec... » read more

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