category: Videos

category: Auto, Security & Edge AI

Die-To-Die Connectivity
By Ed Sperling - 22 Nov, 2019 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

Making Sense Of Inferencing Options
By Ed Sperling - 19 Nov, 2019 - Comments: 0

Ian Bratt, fellow in Arm’s machine learning group, sheds light on all the different processing elements in machine learning, how different end user requirements affect those choices, why CPUs are a critical element in orchestrating what happens in these systems, and how power and software play into these choices. » read more

Reducing Data At The Source
By Ed Sperling - 18 Nov, 2019 - Comments: 0

Jens Döge, group manager for image acquisition and processing in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about how to slash the amount of data that needs to be sent to the cloud or edge for processing by focusing only on the regions of interest in an image, and how that reduces the cost of moving that data. » read more

GDDR6 Drilldown: Applications, Tradeoffs And Specs
By Ed Sperling - 15 Nov, 2019 - Comments: 0

Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

Thermal Challenges And Moore’s Law
By Ed Sperling - 22 Oct, 2019 - Comments: 0

Steven Woo, fellow and distinguished inventor at Rambus, looks at the evolution of graphics cards over a couple of decades and how designs changed to deal with more graphics and more heat, and why smaller, faster and cheaper doesn’t apply in this market. » read more

Making Sense Of ML Metrics
By Ed Sperling - 16 Oct, 2019 - Comments: 0

Steve Roddy, vice president of products for Arm’s Machine Learning Group, talks with Semiconductor Engineering about what different metrics actually mean, and why they can vary by individual applications and use cases. » read more

Monitoring Heat On AI Chips
By Ed Sperling - 11 Oct, 2019 - Comments: 0

Stephen Crosher, CEO of Moortec, talks about monitoring temperature differences on-chip in AI chips and how to make the most of the power that can be delivered to a device and why accuracy is so critical. » read more

The New CXL Standard
By Ed Sperling - 16 Sep, 2019 - Comments: 0

Gary Ruggles, senior staff product marketing manager at Synopsys, digs into the new Compute Express Link standard, why it’s important for high bandwidth in AI/ML applications, where it came from, and how to apply it in current and future designs. » read more

Making Better Use Of Memory In AI
By Ed Sperling - 13 Sep, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about using number formats to extend memory bandwidth, what the impact can be on fractional precision, how modifications of precision can play into that without sacrificing accuracy, and what role stochastic rounding can play. » read more

Machine Learning Inferencing At The Edge
By Ed Sperling - 12 Sep, 2019 - Comments: 1

Ian Bratt, fellow in Arm's machine learning group, talks about why machine learning inferencing at the edge is so difficult, what are the tradeoffs, how to optimize data movement, how to accelerate that movement, and how it differs from developing other types of processors. » read more

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