High NA-EUV resolution; HKMG DRAM reliability; rethinking programmed I/O; survey on HW-SW LLMs; confidentiality of cryptographic keys; spin orbit torque phenomena in GdCo; flexible electronic-photonic 3D integration.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Resolution enhancement for high-numerical aperture extreme ultraviolet lithography by split pupil exposures: a modeling perspective | Fraunhofer IISB and ASML |
| Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM | Sungkyunkwan University and Samsung Electronics |
| Flexible electronic-photonic 3D integration from ultrathin polymer chiplets | Dartmouth College and Boston University |
| Rethinking Programmed I/O for Fast Devices, Cheap Cores, and Coherent Interconnects | ETH Zurich |
| A Survey: Collaborative Hardware and Software Design in the Era of Large Language Models | Duke University and Johns Hopkins University |
| Tunable multistate field-free switching and ratchet effect by spin-orbit torque in canted ferrimagnetic alloy | UC Berkeley and Lawrence Berkeley National Laboratory |
| KeyVisor — A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies | CISPA Helmholtz Center for Information Security and Ruhr University Bochum |
More Reading
Chip Industry Week In Review
AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more.
Technical Paper Library home
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