Planarization Challenges At 7nm And Beyond

Why it’s becoming harder to prepare a wafer at advanced nodes.

popularity

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner.

 

 

_________________________________
See more tech talk videos here

 



Leave a Reply


(Note: This name will be displayed publicly)