tag: 5G

Multi-Layer Attack Graph Analysis in the 5G Edge Network Using a Dynamic Hexagonal Fuzzy Method
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "Overall, 5G networks are expected to become the backbone of many critical IT applications. With 5G, new tech advancements and innovation are expected; 5G currently operates on software-defined networking. This enables 5G to implement network slicing to meet the unique requirements of every application. As a result, 5G is more flexible and scalable than 4G LTE and previous generations... » read more

Domain-Specific Design Drives EDA Changes
By Ann Mutschler - 03 Jan, 2022 - Comments: 0

The chip design ecosystem is beginning to pivot toward domain-specific architectures, setting off a scramble among tools vendors to simplify and optimize existing tools and methodologies. The move reflects a sharp slowdown in Moore's Law scaling as the best approach for improving performance and reducing power. In its place, chipmakers — which now includes systems companies — are pushing... » read more

Industry Transforming In Ways Previously Unimaginable
By Brian Bailey - 30 Dec, 2021 - Comments: 0

Early in the year, everyone expected that the availability of COVID vaccines would signal the start of a return to normal, but that has certainly not been the case. Now the industry is taking a longer-term view about how to transform business, what is necessary for people to maintain their mental health, and how to create robust hybrid work environments for the future that do not discard the po... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022
By Frank Schirrmeister - 22 Dec, 2021 - Comments: 0

Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Building A More Secure U.S. Microelectronic Design Infrastructure
By Jason Oberg - 02 Dec, 2021 - Comments: 0

The security of the U.S. microelectronic designs and their supply chain is becoming a significantly growing concern for both commercial semiconductor companies and the Department of Defense (DoD). The industry has seen significant impact from both silicon shortages and vulnerabilities that have caused disruption in the assurance of microelectronics that power our autonomous vehicles, 5G, and co... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

Power/Performance Bits: Nov. 8
By Jesse Allen - 08 Nov, 2021 - Comments: 0

Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 21 Oct, 2021 - Comments: 0

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

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