Blog Review: Jan. 4

By Jesse Allen - 04 Jan, 2023 - Comments: 0

Siemens EDA's Harry Foster investigates the percentage of total IC/ASIC project time spent in verification and increasing engineering headcount, particularly growing demand for verification engineers. Synopsys' Stelios Diamantidis argues that retargeting older chips using AI offers a way to move chip designs between nodes and absorb the market’s excess capacity. Cadence's Paul McLellan ... » read more

Adapting To Broad Shifts Essential In 2022

By Brian Bailey - 21 Dec, 2022 - Comments: 0

Change creates opportunity, but not every company is able to respond quickly enough to take advantage of those opportunities. Others may respond too quickly, before they properly understand the implications. At the start of a typical year, optimism is in plentiful supply. Any positive trend is seen as continuing, and any negative is seen as turning around. Normally the later in the year that... » read more

Blog Review: Dec. 20

By Jesse Allen - 20 Dec, 2022 - Comments: 0

Synopsys' Twan Korthorst explains how PDKs can help accelerate the photonic IC design process by offering building blocks such as several types of waveguides, passive devices like splitters, combiners, and filters, along with active devices such as phase shifters, detectors, semiconductor optical amplifiers, and lasers. Siemens EDA's Harry Foster examines IC and ASIC design trends, including... » read more

Efficient Trace In RISC-V

By Ed Sperling - 19 Dec, 2022 - Comments: 0

Systems with RISC-V cores often include multiple types of other processors and accelerators. Peter Shields, product manager for Tessent at Siemens Digital Industries Software, talks about what's needed for debug and trace in context, including the need for unobtrusive observation at full speed, what to trace and when to trace it, and how embedded IP can identify to report which branches are tak... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 16 Dec, 2022 - Comments: 0

The CHIPS Act sparked $200 billion in private investments for U.S. semiconductor production, including 40 new semiconductor ecosystem projects, according to SIA. China is working toward self-sufficiency, with plans to invest more than 1 trillion yuan ($143 billion) to support domestic semiconductor production, according to Reuters. Arm said that Britain and the U.S. would not approve license... » read more

Blog Review: Dec. 14

By Jesse Allen - 14 Dec, 2022 - Comments: 0

Siemens EDA's Harry Foster checks out design and verification language adoption trends in FPGA projects, including testbench methodologies and assertion languages. Cadence's Veena Parthan finds that giving electric vehicle batteries a second life as energy storage devices can extend their useful life by 5 to 8 years, but a lack of standardization in EV batteries poses challenges. Synopsys... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13

By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Challenges With Adaptive Control

By Brian Bailey - 08 Dec, 2022 - Comments: 0

Historically, the performance and power consumption of a system was controlled by what could be done at design time, but chips today are becoming a lot more adaptive. This has become a necessity for cutting edge nodes, but also provides a lot of additional benefits at the expense of greater complexity and verification challenges. Design margins are a tradeoff between performance and yield. C... » read more

Bridging The Digital Divide With Ultra Low-Cost Smartphones

By Neil Fletcher - 08 Dec, 2022 - Comments: 0

According to the Alliance for Affordable Internet, 2.5 billion people in emerging economies now have access to mobile broadband coverage, but many still cannot afford the typical smartphone. They need a device that hits the right price point, and also provides the right capabilities to support and enhance them in their daily lives. Despite greater connectivity, hitting this ‘smartphone sweet... » read more

Blog Review: Dec. 7

By Jesse Allen - 07 Dec, 2022 - Comments: 0

Siemens EDA's Harry Foster looks at the continual maturing of FPGA functional verification processes through increasing adoption of various simulation-based and formal verification techniques. Synopsys' Stewart Williams introduces the Scalable Open Architecture for Embedded Edge (SOAFEE) project and how it can make automotive software development, testing, virtual prototyping, and validation... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: ARM