tag: lithography

EUV Flare And Proximity Modeling And Model-Based Correction
By Various Writers - 16 May, 2013 - Comments: 0

The introduction of EUV lithography into the semiconductor fabrication process will enable a continuation of Moore’s law below the 22 nm technology node. EUV lithography will, however, introduce new and unwanted sources of patterning distortions which must be accurately modeled and corrected on the reticle. Flare caused by scattered light in the projection optics is expected to result in seve... » read more

Bringing Electrical Info To Design’s Forefront
By Ann Mutschler - 09 May, 2013 - Comments: 0

By Ann Steffora Mutschler To reflect the impact on transistors of smaller process nodes and the electrical effects that occur as a result, a shift is underway where the electrical analysis and verification that used to be done when the layout was complete is moving earlier in the design process. The analysis includes parasitic extraction of interconnect and device parasitics, electromigrati... » read more

Experts At The Table: Issues In Metrology And Inspection
By Mark LaPedus - 29 Apr, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future metrology and inspection challenges with John Allgair, senior member of the technical staff at GlobalFoundries; Kevin Heidrich, vice president of marketing and business development at Nanometrics; Robert Newcomb, executive vice president at Qcept Technologies; and Shrinivas Shetty, vice president of marketing f... » read more

Throw In The Kitchen Sink
By Ed Sperling - 05 Apr, 2013 - Comments: 0

By Ed Sperling The number of options available for reducing power and improving performance are increasing for the first time in a decade. This is good news for chipmakers. It’s far less clear who stands to benefit on the tools, IP, capital equipment and manufacturing side. Choice is always a good thing in design. It allows teams to trade off one IP block for another, based upon the needs... » read more

Reaching For The Reset Button In Lithography
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Amid ongoing delays and setbacks, extreme ultraviolet (EUV) lithography and multi-beam e-beam have both missed the 10nm logic node. So for the present, chipmakers must take the brute force route at 10nm by using 193nm immersion with multiple patterning. Now, it’s time to hit the reset button. For the 7nm node, chipmakers currently are lining up the lithographic competition... » read more

Making An Impression with Nanoimprint
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss the trends in lithography with Mark Melliar-Smith, president and chief executive of Molecular Imprints Inc. (MII), a supplier of nanoimprint lithography tools. SMD: How do you view the IC industry now? Melliar-Smith: It’s truly incredible work that this industry continues to do. The industry will see its way f... » read more

Directed Self-Assembly Grows Up
By Mark LaPedus - 21 Mar, 2013 - Comments: 1

By Mark LaPedus At last year’s SPIE Advanced Lithography conference, Christopher Bencher, a member of the technical staff at Applied Materials, said the buzz surrounding directed self-assembly (DSA) technology resembled the fervor generated at the famous Woodstock rock concert in 1969. This was clearly evident from the tumultuous and free-flowing movement that threatened the status quo o... » read more

Computational Lithography
By Various Writers - 21 Mar, 2013 - Comments: 0

Computational lithography has become an integral part of design since the 130 nm process node. New techniques continue to be developed to extend the steady node shrink year after year. To read this white paper, click here. » read more

Breakthroughs Required
By Ed Sperling - 21 Mar, 2013 - Comments: 0

Linear progressions have a hypnotic effect on even the smartest people. They lull everyone into thinking that progress—or at least a progression—is a straight line, with little or no recognition that things are changing around the edges. The periphery is definitely changing, though. And over the next couple of process nodes, the semiconductor manufacturing industry either will have to fi... » read more

What’s In A Name?
By Subi Kengeri - 20 Mar, 2013 - Comments: 0

By Subi Kengeri Consumers continue to demand smaller, faster and more energy-efficient electronic devices, driving the semiconductor industry to accelerate development of commercially viable chips on more advanced nodes. However, these new nodes don’t just appear by magic. It takes a great deal of careful planning to develop and deliver a process technology platform that offers competitivene... » read more

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