Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 16 Nov, 2018 - Comments: 0

Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for the sale of the intellectual-property and certain assets associated with its semiconductor test business to Advantest for $185 million in cash. The sale additionally includes a $30 million earn-... » read more

Week In Review: Design, Low Power

By Jesse Allen - 16 Nov, 2018 - Comments: 0

Tools & Standards Mentor uncorked a PCB design platform for non-specialist PCB engineers focused on multi-dimensional verification. The Xpedition platform can integrate a range of verification tools within a singular authoring environment, providing automatic model creation, concurrent simulation, cross probing from results, and error reviews to identify problems at the schematic or layout... » read more

A VC View Of The AI Landscape

By Michael Stewart - 15 Nov, 2018 - Comments: 0

In this blog post, I’ll highlight my takeaways from the recent AI Hardware Summit where I participated as a panelist. The conference’s focus on developing hardware accelerators for neural networks and computer vision attracted companies from across the ecosystem – AI chip startups, semiconductor companies, system vendors/OEMs, data center providers, financial services companies and VCs,... » read more

EUV Mask Blank Battle Brewing

By Mark LaPedus - 15 Nov, 2018 - Comments: 2

Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

Smart Manufacturing Initiative

By Ayo Kajopaiye - 15 Nov, 2018 - Comments: 0

SEMI’s Smart Manufacturing (SM) Initiative has been a gathering place for companies who believe that electronics manufacturing will benefit from the gathering and analysis of production and sensor data, and optimizing processes based on that data. SM principles are focused on increasing speed, improved output and higher quality. Smart Manufacturing relies on simplifying data sharing and co... » read more

New Metrology and Inspection Technologies Needed for More-Than-Moore Markets

By Applied Materials - 14 Nov, 2018 - Comments: 0

The escalating costs of following Moore’s Law have shifted the semiconductor industry’s focus to More-than-Moore (MtM) technologies, where analog/mixed-signal, RF, MEMS, image sensing, power or other technologies may be integrated with CMOS in a variety of planar, 2.5D and 3D architectures. The integration of these and other key technologies is enabling a host of fast-growing application... » read more

Manufacturing Bits: Nov. 13

By Mark LaPedus - 13 Nov, 2018 - Comments: 1

Quantum memories The University of Alberta has developed a new method for making quantum memories, paving the way for a next-generation quantum Internet. Quantum memory is targeted for quantum networks and computers. In classical computing, the information is stored in bits, which can be either a “0” or “1”. In quantum computing, information is stored in quantum bits, or qubits, whi... » read more

Blog Review: Oct. 31

By Jesse Allen - 31 Oct, 2018 - Comments: 0

Mentor's Joe Hupcey III digs into handling memories effectively with formal through abstraction and the easiest ways to address memory-related inconclusive results. Cadence's Paul McLellan explains DARPA's CHIPS program that aims to lower semiconductor design costs through chiplet-based designs, the current status of the work, and what the next steps will be. Synopsys' Sangeeta Kulkarni c... » read more

Carmakers To Chipmakers: Where’s The Data?

By Ed Sperling And Susan Rambo - 24 Oct, 2018 - Comments: 0

The integration of electronics into increasingly autonomous vehicles isn't going nearly as smoothly as the marketing literature suggests. In fact, it could take years before some of these discrepancies are resolved. The push toward full autonomy certainly hasn't slowed down, but carmakers and the electronics industry are approaching that goal from very different vantage points. Carmakers and... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Applied Materials

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

A VC View Of The AI Landscape

EUV Mask Blank Battle Brewing

Smart Manufacturing Initiative

New Metrology and Inspection Technologies Needed for More-Than-Moore Markets

Manufacturing Bits: Nov. 13

Blog Review: Oct. 31

Carmakers To Chipmakers: Where’s The Data?