tag: CNRS

Technical Paper Roundup: November 28
By Linda Christensen - 28 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=169 /] More Reading Technical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Using The Schottky Barrier Transistor in Various Applications & Material Systems
By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A new technical review paper titled "The Schottky barrier transistor in emerging electronic devices" was published by researchers at THM University of Applied Sciences, Chalmers University of Technology, CNRS, University Grenoble Alpes and others. Abstract "This paper explores how the Schottky barrier (SB) transistor is used in a variety of applications and material systems. A discussion of... » read more

Chip Industry’s Technical Paper Roundup: Apr. 18
By Linda Christensen - 18 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=93 /]   If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involv... » read more

Power Semiconductor Devices: Thermal Management and Packaging
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A technical paper titled "Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective" was published by researchers at Virginia Polytechnic Institute and State University, U.S. Naval Research Laboratory, and Univ Lyon, CNRS. "This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged dev... » read more

Chip Industry’s Technical Paper Roundup: Jan 3
By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Graphene-Based Electronics (Georgia Tech)
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "An epitaxial graphene platform for zero-energy edge state nanoelectronics" was published by researchers at Georgia Tech, Tianjin University, CNRS, Synchrotron SOLEIL, National High Magnetic Field Laboratory and others. “Graphene’s power lies in its flat, two-dimensional structure that is held together by the strongest chemical bonds known,” said Walter de Heer... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Dec, 2022 - Comments: 0

Tools, IP, design Codasip launched a new organization within the company to support the development and commercialization of technical innovations in key applications including security, functional safety, and AI/ML. "As semiconductor scaling is showing its limits, there is an obvious need for new ways of thinking. We will be working with universities, research institutes and strategic partner... » read more

Chip Industry’s Technical Paper Roundup: Nov. 29
By Linda Christensen - 29 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=66 /]   Related Reading: Chip Industry’s Technical Paper Roundup: Nov. 21 New papers: lithography modeling; solving Rowhammer; energy-efficient batch normalization HW; 3-to-1 reconfigurable analog signal modulation circuit; lateral double magnetic tunnel junction; reduce branch mispredic... » read more

3D Structuring Inside GaAs by Ultrafast Laser Inscription
By Technical Paper Link - 28 Nov, 2022 - Comments: 0

A new technical paper titled "Burst mode enabled ultrafast laser inscription inside gallium arsenide" was published by researchers at LP3 Laboratory in France, a joint research unit of Aix-Marseille University (AMU) and CNRS. "We investigate the possibility of using THzrepetition-rate burst mode for ULI inside GaAs, a material that cannot be internally processed with single femtosecond pulse... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy