tag: Coventor

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

Blog Review: Dec. 1
By Jesse Allen - 01 Dec, 2021 - Comments: 0

Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Blog Review: Nov. 24
By Jesse Allen - 24 Nov, 2021 - Comments: 0

Cadence's Paul McLellan introduces the theory and practice of datapath formal verification and explores two use cases of dot-product accumulate systolic design and hashing design. Siemens EDA's Rich Edelman shows that constructing an in-order UVM scoreboard doesn't have to be a difficult or complex task, and certainly simpler than replacing a laptop's keyboard. Synopsys' Gordon Cooper con... » read more

Using Process Modeling To Enhance Device Uniformity During Self-Aligned Quadruple Patterning
By Timothy Yang - 18 Nov, 2021 - Comments: 0

Despite the growing interest in EUV lithography, self-aligned quadruple patterning (SAQP) still holds many technical advantages in pattern consistency, simplicity, and cost. This is particularly true for very simple and periodic patterns, such as line & space patterns or hole arrays. The biggest challenge of SAQP is the inherently asymmetric mask shape. This asymmetry can create structural ... » read more

Blog Review: Nov. 3
By Jesse Allen - 03 Nov, 2021 - Comments: 0

In a blog for Arm, Matthew Griffin of the 311 Institute warns that cybersecurity is an increasingly pressing problem, with large criminal organizations raking in large sums of money and attacks able to impact a wide range of physical systems. Cadence's Paul McLellan checks out Google's video encoder chip and how it helps lower the CPU recycles required by the vast number of videos uploaded t... » read more

Evaluating The Impact Of STI Recess Profile Control On Advanced FinFET Performance
By Yu De Chen - 21 Oct, 2021 - Comments: 0

Profile variation is one of the most important problems during semiconductor device manufacturing and scaling. These variations can degrade both chip yield and device performance.  Virtual fabrication can be used to study profile variation in a very effective and economical manner and avoid process cycle time and wafer cost in the fab. In this short article, we will review the impact of STI (s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Oct, 2021 - Comments: 0

Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

Evaluating The Impact Of STI Recess Profile Control On Advanced FinFET Device Performance
By Coventor - 15 Sep, 2021 - Comments: 1

In this paper, a 5nm FinFET flow was built using the SEMulator3D virtual fabrication platform. Different STI (shallow trench isolation) recess profiles were investigated using the pattern-dependent etch capabilities of SEMulator3D, including changes in trenching/footing profile, fin height and imbalance fin height. The impact of STI recess profile on device performance was then investigated usi... » read more

Blog Review: Sept. 15
By Jesse Allen - 15 Sep, 2021 - Comments: 0

Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Blog Review: Sept. 1
By Jesse Allen - 01 Sep, 2021 - Comments: 0

Arm's Fernando Garcia Redondo, Pranay Prabhat, and Mudit Bhargava continue their exploration of MRAM simulation by explaining stochasticity experiments and a characterization framework that focuses on the MRAM behavior statistical analysis. Siemens EDA's Neil Johnson shows how performance profiling can be used to identify testbench code that could slow down simulation and when to start using i... » read more

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