tag: Coventor

Blog Review: Aug. 24
By Jesse Allen - 24 Aug, 2022 - Comments: 0

Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

Big Changes In Architectures, Transistors, Materials
By Ed Sperling - 18 Aug, 2022 - Comments: 0

Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

3D NAND Virtual Process Troubleshooting And Investigation
By Brett Lowe - 18 Aug, 2022 - Comments: 0

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often encountered in the form of unanticipated negative interactions between upstream and downstream process modules. These barriers can create a long delay in the development cycle and increase costs. ... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Scaling, Advanced Packaging, Or Both
By Ed Sperling - 01 Aug, 2022 - Comments: 0

Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

Quantum Computers And CMOS Semiconductors: A Review And Future Predictions
By Michael Hargrove - 16 Jun, 2022 - Comments: 0

With the advent of quantum computing, the need for peripheral fault-tolerant logic control circuitry has reached new heights. In classical computation, the unit of information is a “1” or “0”. In quantum computers, the unit of information is a qubit which can be characterized as a “0”, “1”, or a superposition of both values (known as a “superimposed state”). The control c... » read more

Ultra-Low Resonance Frequency MEMS Gravimeter With Off-Resonance Closed-Loop Control
By Coventor - 16 Jun, 2022 - Comments: 0

This paper reports on a MEMS gravimeter that has a closed-loop system to maintain an ultra-low resonance frequency of 1Hz. The low resonance frequency is attained by using a spring that is the resultant of positive mechanical stiffnesses and negative electrical stiffnesses. Voltage-tunability of the electrical stiffness enables ultra-small and tunable total stiffness. To attain a quick response... » read more

Blog Review: June 15
By Jesse Allen - 15 Jun, 2022 - Comments: 0

Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

Blog Review: May 25
By Jesse Allen - 25 May, 2022 - Comments: 0

Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications
By Gerold Schröpfer - 19 May, 2022 - Comments: 0

The first computers were built using electro-mechanical components, unlike today’s modern electronic systems. Alan Turing’s cryptanalysis multiplier and Konrad Zuse’s Z2 were invented and built in the first half of the 20th century, and were among the first computers ever constructed. Electro-mechanical switches and relays performed logic operations in these machines. Even after computers... » read more

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