E-beam Inspection Makes Inroads

By Mark LaPedus - 18 Jan, 2018 - Comments: 4

E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI and others are developing new e-beam inspection tools and/or techniques to solve some of the more difficult defect issues in the fab. [gettech id="31057" t_name="E-beam"] inspection is one of tw... » read more

Measuring ISO 26262 Metrics Of Analog Circuitry In ICs

By Mentor, a Siemens Business - 04 Jan, 2018 - Comments: 0

The goals for automotive electronics are zero defective parts per million (0 DPPM), and safe operation during the expected lifetime of the vehicle. The ISO 26262 standard provides procedures and metrics required before delivery to ensure systems can be expected to operate without unreasonable risk. ISO 26262 specifies circuit metrics and minimum values that are design requirements. Since the... » read more

Process Window Discovery And Control

By Andrew Cross - 18 Dec, 2017 - Comments: 0

With the continued need for shrinking pattern dimensions, semiconductor manufacturers continue to implement more complex patterning techniques, such as advanced multi-patterning, for the 10nm design node and beyond. They also are investing significant development effort in readying EUV lithography for production at the 7/5nm design nodes. Additionally, semiconductor manufacturers’ use of desi... » read more

Nontraditional Post Develop Inspection And Review Strategy For Via Defects

By KLA - 18 Dec, 2017 - Comments: 0

A viable in-line monitor for missing vias in the back end of line (BEOL) has traditionally been challenging due to the nature of the defects. Today’s available solutions do not meet the requirements of a true in-line and at-level monitor strategy. These solutions either indirectly monitor the defect further down the line, put production at risk of damage or contamination due to exceeding stri... » read more

Searching For EUV Mask Defects

By Mark LaPedus - 19 Oct, 2017 - Comments: 2

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

Devices Threatened By Analog Content?

By Brian Bailey - 09 Feb, 2017 - Comments: 0

As the amount of analog content in connected devices explodes, ensuring that the analog portion works properly has taken on a new level of urgency. Analog circuitry is required for interpreting the physical world and for moving data to other parts of the system, while digital circuitry is the fastest way to process it. So a sensor that gives a faulty reading in a car moving at high speed or ... » read more

Power/Performance Bits: Oct. 4

By Jesse Allen - 04 Oct, 2016 - Comments: 0

Solar battery Chemists at the University of Wisconsin–Madison and the King Abdullah University of Science and Technology in Saudi Arabia integrated solar cells with a large-capacity battery in a single device that eliminates the usual intermediate step of making electricity and, instead, transfers the energy directly to the battery's electrolyte. The team used a redox flow battery, or R... » read more

New Drivers For Test

By Brian Bailey - 28 Jul, 2016 - Comments: 0

Mention Design for Test (DFT) and scan chains come to mind, but there is much more to it than that—and the rules of the game are changing. New application areas such as automotive may breathe new life into built-in self-test (BIST) solutions, which could also be used for manufacturing test. So could DFT as we know it be a thing of the past? Or will it continue to have a role to play? Te... » read more

Power/Performance Bits: May 24

By Jesse Allen - 24 May, 2016 - Comments: 0

Reducing MRAM chip area Researchers from Tohoku University developed a technology to stack magnetic tunnel junctions (MTJ) directly on the via without causing deterioration to its electric/magnetic characteristics. The team focused on reducing the memory cell area of spin-transfer torque magnetic random access memory (STT-MRAM) in order to lower manufacturing costs, making them more compe... » read more

Improving Transistor Reliability

By Katherine Derbyshire - 21 Apr, 2016 - Comments: 1

One of the more important challenges in reliability testing and simulation is the duty cycle dependence of degradation mechanisms such as negative bias temperature instability ([getkc id="278" kc_name="NBTI"]) and hot carrier injection (HCI). For example, as previously discussed, both the shift due to NBTI and the recovery of baseline behavior are very dependent on device workload. This is ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: defects