LPDDR Flash In Automotive

By Ed Sperling - 15 May, 2023 - Comments: 0

New automotive architectures are raising challenges for how to utilize memory effectively and efficiently. An LPDDR interface for flash allows different processors to utilize multiple banks of flash memory, which in turn reduces latency and interference. Sandeep Krishnegawda, vice president of marketing and applications at Infineon, talks about the new zonal controllers in automotive design and... » read more

The Hidden Security Risks Of Automotive Electronic Systems

By Adrian Cosoroaba - 06 Apr, 2023 - Comments: 0

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work and play. However, as our lives become more connected, the risk from hackers and other security breaches increases with every new IoT device. While most of us are pretty well versed in why we need to keep our most trusted devices secure – such as cell phones and laptops – we often don’t think ... » read more

Ferroelectric Memories: The Middle Ground

By Katherine Derbyshire - 19 Jan, 2023 - Comments: 0

The first article in this series considered the use of ferroelectrics to improve subthreshold swing behavior in logic transistors. The prospects for ferroelectrics in logic applications are uncertain, but ferroelectric memories have clear advantages. The two most common commercial memories lie at opposite ends of a spectrum. DRAM is fast, but requires constant power to maintain its informat... » read more

Memory-Based Cyberattacks Become More Complex, Difficult To Detect

By John Koon - 03 Nov, 2022 - Comments: 0

Memories are becoming entry points for cyber attacks, raising concerns about system-level security because memories are nearly ubiquitous in electronics and breaches are difficult to detect. There is no end in sight with hackers taking aim at almost every consumer, industrial, and commercial segment, and a growing number of those devices connected to the internet and to each other. According... » read more

Is There A Limit To The Number of Layers In 3D-NAND?

By Karen Heyman - 24 Aug, 2022 - Comments: 1

Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

Making More Reliable And More Efficient Auto ICs

By Ed Sperling - 05 May, 2022 - Comments: 0

Sam Geha, executive vice president of memory solutions at Infineon Technologies, sat down with Semiconductor Engineering to talk about automotive chips, supply chain issues, and integration challenges. What follows are excerpts of that conversation. SE: How do you build an automotive chip that will work in any environment? Geha: The automotive market is, of course, one of the most demand... » read more

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors

By Technical Paper Link - 02 May, 2022 - Comments: 0

Research paper from KAIST and Gachon University. Abstract "Multi-valued logic (MVL) circuits based on heterojunction transistor (HTR) have emerged as an effective strategy for high-density information processing without increasing the circuit complexity. Herein, an organic ternary logic inverter (T-inverter) is demonstrated, where a nonvolatile floating-gate flash memory is employed to ... » read more

Micron B47R 3D CTF CuA NAND Die, World’s First 176L (195T)

By Jeongdong Choe - 19 Aug, 2021 - Comments: 0

Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND is one of the most groundbreaking technologies to date, and it is especially for the storage application such as data center, 5G, AI, cloud, intelligent edge, and mobile devices. Mi... » read more

Making Sense Of New Edge-Inference Architectures

By Bryon Moyer - 04 Mar, 2021 - Comments: 0

New edge-inference machine-learning architectures have been arriving at an astounding rate over the last year. Making sense of them all is a challenge. To begin with, not all ML architectures are alike. One of the complicating factors in understanding the different machine-learning architectures is the nomenclature used to describe them. You’ll see terms like “sea-of-MACs,” “systolic... » read more

More Data, More Memory-Scaling Problems

By Bryon Moyer - 14 Jan, 2021 - Comments: 0

Memories of all types are facing pressures as demands grow for greater capacity, lower cost, faster speeds, and lower power to handle the onslaught of new data being generated daily. Whether it's well-established memory types or novel approaches, continued work is required to keep scaling moving forward as our need for memory grows at an accelerating pace. “Data is the new economy of this ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?