Better Choreography Required For Complex Chips

By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

Heterogeneous Integration — Chiplets

By Expedera - 21 Jun, 2023 - Comments: 0

Chiplets are a hot topic in the semiconductor industry, and to many, represent a paradigm change for chip designers and chip consumers alike. While heterogenous chiplets seem to have multiple advantages over traditional monolithic silicon and even homogenous chiplets, they still have not been mass-market deployed. This white paper, published in cooperation with the Global Semiconductor Alliance... » read more

Chip Design CEO Outlook

By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

Chips Getting More Secure, But Not Quickly Enough

By Ed Sperling - 22 May, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of heterogeneous integration, more advanced RISC-V designs, and a growing awareness of security threats, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketin... » read more

Enabling New Functionality In Medtech And Biotech Devices

By Dick Otte - 18 May, 2023 - Comments: 0

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices

By Promex Industries - 19 Apr, 2023 - Comments: 0

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Click here to read more. » read more

Impact Of Increased IC Performance On Memory

By Ed Sperling - 30 Mar, 2023 - Comments: 0

Increasing performance in advanced semiconductors is becoming more difficult as chips become more complex. There are more physical effects to contend with, different use cases, and challenges in making memory go faster. In addition, aging effects that once were ignored are now becoming critical concerns. Steven Woo, fellow and distinguished inventor at Rambus, talks about different factors that... » read more

Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices

By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A technical paper titled "Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED" was published by researchers at Tohoku University in Japan. Abstract: "This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100- μm -cubed blue μ LED... » read more

Test Challenges Mount As Demands For Reliability Increase

By Anne Meixner - 07 Mar, 2023 - Comments: 0

An emphasis of improving semiconductor quality is beginning to spread well beyond just data centers and automotive applications, where ICs play a role in mission- and safety-critical applications. But this focus on improved reliability is ratcheting up pressure throughout the test community, from lab to fab and into the field, in products where transistor density continues to grow — and wh... » read more

How To Build Resilience Into Chips

By Ed Sperling and Ann Mutschler - 27 Feb, 2023 - Comments: 0

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: heterogeneous integration