tag: heterogeneous integration

Challenges Of Heterogeneous Integration
By Ed Sperling - 13 Jul, 2023 - Comments: 0

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology, talks about a variety of issues ranging from uneven aging, warpage, and different mechanical stresse... » read more

Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections
By Keith Best - 11 Jul, 2023 - Comments: 0

All great voyages must come to an end. Such is the case with our series on the challenges facing the manufacturing of advanced IC substrates (AICS), the glue holding the heterogeneous integration ship together. In our first blog, we examined how cumulative overlay drift from individual redistribution layers could significantly increase overall trace length, resulting in higher interconnect res... » read more

Heterogeneous Integration As A Path Towards Sustainable Computing, Using Chiplets
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "Towards Sustainable Computing: Assessing the Carbon Footprint of Heterogeneous Systems" was published by researchers at Arizona State University and University of Minnesota. Abstract: "Decades of progress in energy-efficient and low-power design have successfully reduced the operational carbon footprint in the semiconductor industry. However, this has led to an incre... » read more

Impact of CMOS Image Sensors Fabrication Processes On The Quality Of Smartphone Pictures
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. Abstract: "CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of ima... » read more

Better Choreography Required For Complex Chips
By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

Heterogeneous Integration — Chiplets
By Expedera - 21 Jun, 2023 - Comments: 0

Chiplets are a hot topic in the semiconductor industry, and to many, represent a paradigm change for chip designers and chip consumers alike. While heterogenous chiplets seem to have multiple advantages over traditional monolithic silicon and even homogenous chiplets, they still have not been mass-market deployed. This white paper, published in cooperation with the Global Semiconductor Alliance... » read more

Chip Design CEO Outlook
By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

Chips Getting More Secure, But Not Quickly Enough
By Ed Sperling - 22 May, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of heterogeneous integration, more advanced RISC-V designs, and a growing awareness of security threats, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketin... » read more

Enabling New Functionality In Medtech And Biotech Devices
By Dick Otte - 18 May, 2023 - Comments: 0

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices
By Promex Industries - 19 Apr, 2023 - Comments: 0

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Click here to read more. » read more

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