tag: Infineon Technologies

Chip Industry’s Technical Paper Roundup: Feb. 21
By Linda Christensen - 21 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=82 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Looking Forward To SPIE, And Beyond
By Katherine Derbyshire - 16 Feb, 2023 - Comments: 0

On the eve of this year’s SPIE Advanced Lithography + Patterning conference, I took a look at the IEEE Devices and Systems Roadmap’s lithography section. It’s especially notable for the emergence of EUV lithography, which has quickly become critical for advanced logic. High-NA tools to support still smaller dimensions are on the horizon. In the near-term, though, the key challenge is not ... » read more

Automotive MCUs: Digital Twin of the LBIST Functionality
By Technical Paper Link - 15 Feb, 2023 - Comments: 0

A new technical paper titled "A Novel LBIST Signature Computation Method for Automotive Microcontrollers using a Digital Twin" was written by researchers at Infineon Technologies, University of Bremen, and DFKI GmbH. Abstract "LBIST has been proven to be an effective measure for reaching functional safety goals for automotive microcontrollers. Due to a large variety of recent innovative fea... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Feb, 2023 - Comments: 0

Arm is heading for an IPO this year, with plans "fairly well developed and underway now," CEO Rene Haas told Reuters. Arm reported fiscal Q3 revenue of $746 million, up 28% compared with the same period in 2021, setting the stage for a public offering. The company noted it had double- or triple-revenue increases in automotive, consumer, infrastructure, and IoT. The Si2 Compact Model Coalit... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Feb, 2023 - Comments: 0

General Motors (GM) made a deal with GlobalFoundries (GF) to have chips made at the U.S.-based foundry in upstate New York for GM’s key suppliers. GF will expand its production capabilities exclusively for GM’s supply chain, while GM promises to bring economies of scale through its strategy to reduce the unique types of chips needed in products. J.D. Power released its 2023 U.S. Vehicle ... » read more

Countering The Threat From Quantum Computers
By Infineon - 01 Feb, 2023 - Comments: 0

Quantum computers hold much promise for the future, yet their computing power poses a significant threat to current security methods such as public key cryptography. In this white paper, Infineon will examine this issue in detail, propose an approach for future security based on TPMs and discuss current TPM technology. The reader can expect to gain a good appreciation of the security issues sur... » read more

Week In Review: Design, Low Power
By Susan Rambo - 27 Jan, 2023 - Comments: 0

Electronic system design (ESD) industry revenue is up 8.9% from $3,458.2 million in Q3 2021 to $3,767.4 million in Q3 2022 according to a report from SEMI’s ESD Alliance. Read our in-depth take on what this means. In an attempt to make a viable reusable DNA biosensor probe, NIST researchers used an extremely low-power FETdeveloped at CEA-LETI to remove noise in their DNA biosensor circuitr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Jan, 2023 - Comments: 0

Worldwide semiconductor revenue increased 1.1% in 2022 to $601.7 billion, up from $595 billion in 2021, according to preliminary results from Gartner. The combined revenue of the top 25 semiconductor vendors increased 2.8% in 2022 and accounted for 77.5% of the market. The memory segment posted a 10% revenue decrease. Analog showed the strongest growth, up 19% from 2021, followed by discretes, ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 Jan, 2023 - Comments: 0

The head of the U.S. National Transportation Safety Board (NTSB), Jennifer Homendy, voiced concern about the impact of heavier electric vehicles (EVs) will have in crashes with smaller cars with internal combustion engines (ICEs). Homendy compared the weight of the GMC Hummer and the Ford F-150’s EV to ICE version and found the EVs are 2,000 to 6,000 pounds heavier. The extra weight in EVs is... » read more

Automotive Safety: Having The Right Product Portfolio In Place
By Infineon - 04 Jan, 2023 - Comments: 0

Changes are happening in almost every aspect of automotive technology, although the main thrust can be encompassed in three megatrends. In the future, vehicles will be increasingly connected, and therefore cybersecurity protection is becoming more and more important. e-mobility will be a major contributor to CO2 reduction, resulting in the need for high-power semiconductors. And automated drivi... » read more

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