tag: RF

China: Fab Boom or Bust?
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

Advanced Wafer Level Packaging Of RF-MEMS With RDL Inductor
By STATS ChipPAC - 06 Mar, 2017 - Comments: 0

The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased functional convergence in the radio, which translates into increased packaging complexity and sophistication. This is creating unprecedented demand for RF components providing more integration- in ... » read more

Betting On Wafer-Level Fan-Outs
By Ed Sperling - 06 Feb, 2017 - Comments: 2

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Foundries See Mixed Future
By Mark LaPedus - 21 Dec, 2016 - Comments: 1

Amid a tumultuous business environment, the silicon foundry industry is projected to see steady growth in a number of process segments in 2017. As in past years, the foundry market is expected to grow faster than the overall IC industry in 2017. But at the same time, the IC industry—the foundry customer base—continues to witness a frenetic wave of merger and acquisition activity. Basical... » read more

Analog’s Rising Status
By Ann Mutschler - 08 Dec, 2016 - Comments: 1

As more sensors and actuators are added into electronic devices, pressure is growing to more seamlessly move data seamlessly back and forth between analog and digital circuitry. [getkc id="37" kc_name="Analog"] and digital always have fit rather uncomfortably together, and that discomfort has grown as [getkc id="81" kc_name="SoCs"] are built using smaller feature sizes. While digital transis... » read more

7nm Design Success Starts With Multi-Domain Multi-Physics Analysis
By Arvind Vel - 28 Nov, 2016 - Comments: 1

Companies can benefit from advancements in the latest semiconductor process technology by delivering smaller, faster and lower power products, especially for those servicing mobile, high performance computing and automotive ADAS applications. By using 7nm processes, design teams are able to add a lot more functionality onto a single chip and lower the power consumption by scaling operating volt... » read more

Implementing ESD Protection In Today’s SoCs
By Karthik Srinivasan - 08 Sep, 2016 - Comments: 0

As the semiconductor industry transitions to FinFETs, reliability challenges are increasing. ESD designers are challenged with new issues that would require significant rethinking and redesign of their existing ESD protection strategy. With significant complexity embedded in the silicon, failure analysis and silicon debug is challenging and time consuming even to the ESD experts. Technology ... » read more

How Small Will Transistors Go?
By Mark LaPedus - 18 Aug, 2016 - Comments: 1

By Mark LaPedus & Ed Sperling There is nearly universal agreement that Moore’s Law is slowing down. But whether it will truly end, or just become too expensive and less relevant—and what will supplant device scaling—are the subject of some far-reaching research and much discussion. Semiconductor Engineering sat down with each of the leaders of three top research houses—[getent... » read more

Bridging The Gap Between RF Front-End Module Characterization And Production Test With The Semiconductor Test System
By NI - 17 Aug, 2016 - Comments: 0

The rapid evolution of wireless connectivity has driven continual consumer thirst for more data throughput and reduced time to market. These pressures have led to modern signaling standards such as 802.11ac and LTE-Advanced, which have placed even more challenging design and test requirements on the most nonlinear and energy-demanding component in the transmitter, the RF power amplifier. The in... » read more

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