tag: TU Dresden

Emulation System for Racetrack Memories Based on FPGA
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A technical paper titled "ERMES: Efficient Racetrack Memory Emulation System based on FPGA" was written by researchers at University of Calabria and TU Dresden. "This paper presents a new emulation system for RTMs based on heterogeneous FPGA-CPU Systems-on-Chips (SoCs). Thanks to its high flexibility, the proposed emulator can be easily configured to evaluate different memory architectures. ... » read more

Ferroelectric Memories: The Middle Ground
By Katherine Derbyshire - 19 Jan, 2023 - Comments: 0

The first article in this series considered the use of ferroelectrics to improve subthreshold swing behavior in logic transistors. The prospects for ferroelectrics in logic applications are uncertain, but ferroelectric memories have clear advantages. The two most common commercial memories lie at opposite ends of a spectrum. DRAM is fast, but requires constant power to maintain its informat... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

3-to-1 Reconfigurable Analog Signal Modulation Circuit On A Single Device
By Technical Paper Link - 18 Nov, 2022 - Comments: 0

A new technical paper titled "Three-to-one analog signal modulation with a single back-bias-controlled reconfigurable transistor" was published by researchers at NaMLab gGmbH, GlobalFoundries, and TU Dresden. "Reconfigurable field effect transistors are an emerging class of electronic devices, which exploit a structure with multiple independent gates to selectively adjust the charge carrier ... » read more

Technical Paper Round-Up: July 5
By Linda Christensen - 05 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=36 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

TU Dresden: Tile-based Multi-Core Architecture for Heterogeneous RISC-V Processors Suitable for FPGA Platforms
By Technical Paper Link - 04 Jul, 2022 - Comments: 0

New technical paper titled "AGILER: An Adaptive Heterogeneous Tile-Based Many-Core Architecture for RISC-V Processors" from researchers at Technische Universitaet Dresden (TU Dresden). Partial Abstract: "In this work, AGILER is proposed as an adaptive tile-base many-core architecture for heterogeneous RISC-V based processors. The proposed architecture consists of modular and adaptable heter... » read more

Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Cu/SiO₂ Hybrid Bond Interconnects
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Technical paper titled "Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests" from researchers at TU Dresden and others. Abstract: "The focus of this study is a detailed characterization of hybrid Cu/SiO 2 wafer-to-wafer bonding interconnects after reliability testing. Hybrid bonding (or direct bond interconnect) is a technology of choice for fine pitch... » read more

Technical Paper Round-Up: June 8
By Linda Christensen - 08 Jun, 2022 - Comments: 0

  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Hybrid Sensing Platform w/Silicon Nanowires on a Fully Functional CMOS Chip Containing the Readout Electronics & Signal amplification
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Multisite Dopamine Sensing With Femtomolar Resolution Using a CMOS Enabled Aptasensor Chip" from TU Dresden, Riken Quantitative Biological Center, Imperial College London, NaMLab gGmbH, ETH Zürich, MaxWell Biosystems AG, TU Wien, and Institute of Radiopharmaceutical Cancer Research. Abstract "Many biomarkers including neurotransmitters are found in external bo... » read more

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