Vulnerability of Neural Networks Deployed As Black Boxes Across Accelerated HW Through Electromagnetic Side Channels


This technical paper titled "Can one hear the shape of a neural network?: Snooping the GPU via Magnetic Side Channel" was presented by researchers at Columbia University, Adobe Research and University of Toronto at the 31st USENIX Security Symposium in August 2022. Abstract: "Neural network applications have become popular in both enterprise and personal settings. Network solutions are tune... » read more

Techniques For Improving Energy Efficiency of Training/Inference for NLP Applications, Including Power Capping & Energy-Aware Scheduling


This new technical paper titled "Great Power, Great Responsibility: Recommendations for Reducing Energy for Training Language Models" is from researchers at MIT and Northeastern University. Abstract: "The energy requirements of current natural language processing models continue to grow at a rapid, unsustainable pace. Recent works highlighting this problem conclude there is an urgent need ... » read more

Using GPUs to Speed Up DFIT Analysis


Researchers at National University of Singapore and an independent researcher presented a new technical paper titled "FlowMatrix: GPU-Assisted Information-Flow Analysis through Matrix-Based Representation" at the USENIX Security Symposium in Boston in August 2022. Abstract: "Dynamic Information Flow Tracking (DIFT) forms the foundation of a wide range of security and privacy analyses. The ... » read more

Scaling, Advanced Packaging, Or Both


Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

Overcoming Signal, Power, And Thermal Challenges Implementing GDDR6 Interfaces


Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integ... » read more

Effect of Different Frequency Scaling Levels on Memory in Regard to Total Power Consumption in Mobile MPSoC


New technical paper titled "CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical Systems" from researchers at University of Essex, Nosh Technologies, and University of Southampton. Abstract "Most modern mobile cyber-physical systems such as smartphones come equipped with multi-processor systems-on-chip (MPSoCs) with variant computing capacity both to cater to performance r... » read more

Repositioning For A Changing IC Market


Sailesh Chittipeddi, executive vice president at Renesas, sat down with Semiconductor Engineering to talk about how changes in end markets are shifting demand for technology. What follows are excerpts of that conversation. SE: Renesas has acquired a number of companies over the past several years. What's the goal? Chittipeddi: The goal very simply is to create an industry leading solutio... » read more

Preparing For Test Early In The Design Flow


Until very recently, semiconductor design, verification, and test were separate domains. Those domains have since begun to merge, driven by rising demand for reliability, shorter market windows, and increasingly complex chip architectures. In the past, products were designed from a functional perspective, and designers were not concerned about what the physical implementation of the product ... » read more

Growth Spurred By Negatives


The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Future Challenges For Advanced Packaging


Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

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