tag: on-chip variation

True 3D-IC Problems
By Brian Bailey - 27 Apr, 2023 - Comments: 0

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This is very different from 2.5D integration, where logic is placed side-by-side, connected by an interposer. And there are some intermediate solutions today where significant memory is stacked on l... » read more

Challenges With Stacking Memory On Logic
By Ed Sperling - 22 Dec, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Model Variation And Its Impact On Cell Characterization
By Umang Doshi - 05 Nov, 2020 - Comments: 0

EDA (Electronic Design Automation) cell characterization tools have been used extensively to generate models for timing, power and noise at a rapidly growing number of process corners. Today, model variation has become a critical component of cell characterization. Variation can impact circuit timing due to process, voltage, and temperature changes and can lead to timing violations, resulting i... » read more

No Two Chips Are Alike
By Alex Burlak - 27 Jul, 2020 - Comments: 0

As semiconductor processes continue to shrink it’s becoming increasingly challenging to manage the parameters of individual devices not only across the diameter of the wafer, but also across the length of a single chip, especially for a complex chip with a large area. Today’s standard approach to this problem is to assume the worst case and to create a sub-optimal design that accommodates t... » read more

Tech Talk: On-Chip Variation
By Ed Sperling - 01 Mar, 2018 - Comments: 0

Raymond Nijssen, vice president of systems engineering at Achronix, discusses on-chip and process variation at 7nm and 5nm, the role of embedded FPGAs, and how to reduce margin and pessimistic designs. https://youtu.be/LQnw_3H9soQ » read more

Addressing Process Variation And Reducing Timing Pessimism At 16nm And Below
By Cadence - 13 Jul, 2016 - Comments: 0

At 16nm and below, on-chip variation (OCV) becomes a critically important issue. Increasing process variation makes a larger impact on timing, which becomes more pronounced in low-power designs with ultra-low voltage operating conditions. In this paper, we will discuss how a new methodology involving more accurate library characterization and variation modeling can reduce timing margins in libr... » read more

Multi-Source CTS Delivers Flexible High Performance and Variation Tolerance
By Various Writers - 26 Jul, 2012 - Comments: 0

Multi-source clock tree is a hybrid containing the best aspects of a conventional clock tree and a pure clock mesh. This paper illustrates the benefits such as lower skew and better on-chip-variation (OCV) performance compared to a conventional clock tree. To download this white paper, click here. » read more

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