Manufacturing Bits: Feb. 9


3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

Power/Performance Bits: Feb. 2


Single electron transistors A group coordinated by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) is setting out on a four year program to develop single electron transistors fully compatible with CMOS technology and capable of room temperature operation. The single electron transistor (SET) switches electricity by means of a single electron. The SET is based on a quantum dot (consisting... » read more

Manufacturing Bits: Jan. 19


Bubble-pen lithography The University of Texas at Austin has developed a new nano-patterning technology--bubble-pen lithography. Researchers have devised a bubble-pen that enables optically-controlled microbubbles. The bubbles are used to pattern structures onto a surface at tiny dimensions. Bubble-pen lithography could be used in microelectronics, nanophotonics, and nanomedicine. In si... » read more