Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and talent.
Billions of dollars have been pouring into Asian countries for the past few years in an effort to boost their production capacity, explore leading-edge technology, compete on the global stage, and shore up supply chains in the face of geopolitical turmoil.
Each country has its own plan to maintain a foothold in the global market, from China’s Big Fund to Korea’s Yongin Cluster and Japan’s Rapidus consortium. Meanwhile, India and Southeast Asia have launched numerous programs to attract international companies and build talent pipelines to support new facilities.
(See below for background information on Government Programs in select Asian countries and Tables showing select 2024 or late 2023 announcements. This is the fourth and final article in a series on government funding around the globe. Global is here. Americas is here. EMEA is here.)
No country has achieved end-to-end supply chain independence, and it seems that co-operation between like-minded countries is here to stay.
“We see interdependence across the global semiconductor ecosystem,” said Nina Lin, vice president and general manager of Southeast Asia EDA at Siemens Digital Industries Software. “The semiconductor industry is highly complex. It requires a broad spectrum of resources, deep technical knowledge and expertise. It also requires partnerships and collaborations to effectively and seamlessly manage every semiconductor lifecycle stage, including end-to-end traceability, real-time visibility, lifecycle management, and supply chain manufacturing, just to name a few. It thus requires the whole ecosystem to evolve.”
Alongside the competition to build capacity and develop technology is the challenge to find talent in a market where younger generations are demanding more from their employers than a paycheck.
“We’re witnessing a transition happening in the workforce in many parts of the world,” said Lin. “Experienced employees are reaching retirement or moving into new roles, software and electronics engineering skills are growing in demand, and the next generation of engineers wants to work for companies that can demonstrate sustainability, corporate responsibility, and technological innovation. New roles and skill compositions will be needed as companies increasingly integrate advanced technologies like artificial intelligence and machine learning (AI and ML) into their manufacturing environments. Ensuring that new waves of employees are equipped with appropriate knowledge and tools will be crucial.”
For companies focused purely on AI hardware or design, there is an extra challenge. “The world is not rife with AI talent today,” said Paul Karazuba, vice president of marketing at Expedera. “10 years from now, it’s going to be different.”
In such a competitive environment for top talent, a global workforce strategy can come down to the old saying, ‘It’s not what you know but who.’ “We meet people through trade shows or through technology, but more often than not, it’s through connections,” said Karazuba. “As big as the semiconductor industry can seem, it is also a small world. We tend to know people everywhere.”
One way to fill a talent gap is to open an international office where the talent already exists instead of importing workers to a domestic location. For example, Lam Research recently opened a new campus in the Korea government-backed Yongin semiconductor cluster. It also partnered with the Korean Semiconductor Industry Association and Sungkyunkwan University on education and workforce development.
Likewise, Expedera took a targeted approach in India. “We had wanted to expand in India, and the particular location was chosen because we knew of a very small but very experienced group of AI engineers who were looking to make a move as a group,” said Karazuba. “So rather than ask them to move somewhere else, which is a difficult and expensive thing to do, we just opened an office in that location. That’s what happened with our UK location, as well. We knew of three particular engineers and we really wanted them, so we decided, ‘Let’s just open an office there.’ Our offices in Asia initially were chosen for proximity to customers, but we’re not going to open an office unless we know that there’s a local talent base. In Taipei, Shanghai, Singapore, everyone knows there’s chip talent. And moving forward, we certainly want to hire people in existing offices, but it’s going to be that same approach. If we can identify local talent, as long as it is a business-friendly location, and an IP-friendly location in terms of the laws, then we’re going to open an office near talent.”
India is a rising star due to its rich talent pool. The country’s first fabs have received government approval for construction and EDA companies have had a presence for years.
For example, Cadence has been a part of the Indian government’s Specialized Manpower Development Program (SMDP) in VLSI Design, Phases I and II, from the year of its establishment, according to Jayashankar Narayanankutti, sales group director for Cadence Design Systems (India). “Phase I started in 1998, so it has been a long collaboration,” he said.
More recently, Cadence collaborated with the All India Council for Technical Education (AICTE) committee on a model curriculum for an undergraduate degree in electronics engineering (VLSI), and the company’s software is accessible through the national Electronic Design Automation (EDA) grid to all startups selected for the Design Linked Incentive (DLI) program. “This integration supports startups across India in leveraging advanced electronic design automation tools to enhance their product development capabilities,” said Narayanankutti.
Cadence is working with India’s MeitY (Ministry of Electronics & Information Technology) for the Chips to Startups program (C2S) to provide EDA tools to 150 universities, aiming to develop a pool of 85,000 trained engineers by 2027, said Narayanankutti. “Additionally, Cadence aligns with the ChipIn initiative overseen by CDAC (Centre for Development of Advanced Computing), enabling universities to engage in both research and development for chip design while also fostering startup creation in this critical sector.”
Siemens, Synopsys, Ansys, and Keysight also contributed to the ChipsIn Center, while Lam Research partnered with Indian institutions to teach semiconductor fabrication and donated software.
Countries such as Vietnam, Malaysia, and Singapore also have seen a slew of government/industry partnerships. “In recent years, ASEAN [the Association of Southeast Asian Nations] governments are increasingly investing in the semiconductor industry to create high end value jobs, especially in the front-end IC design and foundries,” said Lin.
For example, Synopsys, Cadence, and Siemens all partnered the Vietnam National Innovation Center (NIC) to support IC design and workforce development, among other initiatives. Siemens also partnered with Saigon Hi-Tech Park and Vietbay. “These programs are scalable and are able to extend to front end foundry (FAB),” said Lin.
Synopsys has multiple initiatives underway worldwide, in Asia, and Southeast Asia. In Singapore, the company builds curriculum with Singapore Semiconductor Industry Association (SSIA) and Nanyang Technical University. In Taiwan, it works with government entities to help fund academic programs, support research, and run the Purple 100 Program, which trains about 100 participants annually in front-end and back-end design. Synopsys also is working with National Yang Ming Chiao Tung University (NYCU) to establish the NYCU-Synopsys EDA/AI Research Center. In India, the company partnered with the Indian Institute of Technology (IIT) Bombay to sponsor the Synopsys Semiconductor Lab for Virtual Fab Solutions. It uses its SARA program to engage in end-to-end solutions, and collaborates with over 30 institutions on curriculum review and enhancement.
As the demand for semiconductors continues to grow, with ever-evolving applications and end products, the demand for talent, R&D, and manufacturing capacity also will rise.
“We see semiconductors at the center of a changing world and the heartbeat of today’s smart technology,” said Siemens’ Lin. “After the disruption of a pandemic, we see the frailty of supply chains, and also the role technology plays in connecting people. There’s huge potential that AI will bring in, enabling new possibilities and transforming the industries. Society is also demanding more sustainable and responsible corporate management, and companies must balance societal responsibility with cost.”
The following provides a summary of significant government initiatives in select Asian countries along with a table of announcements made in 2024.
Taiwan government funding
Taiwan’s Ministry of Economic Affairs (MoEA) invests primarily via its Ministry of Science and Technology, with initiatives such as the A+ Industrial Innovative R&D Program, under which it offers the Industrial Technology Foresight Research Program, the Global Innovation Partnership Initiatives Program, and the A+ Startup Technology Enhancement Program (A+STEP). A key regulation to support these efforts is the Statute for Industrial Innovation (Jun 2023).
The Taiwanese government has strong ties with many companies, including NVIDIA. For example, in 2018 NVIDIA said it would co-invest with the government to bring its advanced technology to Taiwan. Then, in May 2023, the company said it would invest up to TWD24.3 billion (US$790 million) in an AI research center, to be jointly managed by National Taiwan University, with a government subsidy of TWD6.7 billion. Its supercomputer, Taipei-1, is up and running in Kaohsiung.
The government reportedly spent about NT$6.5 billion (US$211.6 million) in five years supporting local equipment and materials suppliers to build their R&D capabilities. In addition, Invest Taiwan has a semiconductor division to encourage foreign companies, such as Cadence, to build in the country.
Japan government funding
Most Japanese government funding is made via its Ministry of Economy, Trade and Industry (METI). Other agencies include the Japan External Trade Organization (JETRO) and the New Energy and Industrial Technology Development Organization (NEDO).
In November 2024, Prime Minister Shigeru Ishiba announced the government will invest ¥10 trillion ($65 billion) or more by 2030 to revitalize its semiconductor industry, according to CNBC. Major investments already have gone into the Rapidus consortium — ¥70 billion in November 2022; ¥260 billion in April 2023; and up to 590 billion yen in April 2024. NEDO approved Rapidus’ 024 budget in April.
Another key recipient is the TSMC-led Japan Advanced Semiconductor Manufacturing (JASM), which received nearly $8 billion in government funding to build two foundries.
In 2022, METI launched an R&D organization for next-generation semiconductors, named the Leading-edge Semiconductor Technology Center, but no funding was announced. In 2024, METI invested up to 72.5 billion yen into five projects for improving computational resources necessary for developing AI.
In addition, the Japanese Investment Corp. is a government-backed fund that supports next-gen technology, including semiconductors. The fund offered to buy materials company JSR in March 2024.
Taiwan and Japan collaborate through the JASM venture and also the SEMI-backed International Taiwan-Japan Semiconductor Technology Symposium.
South Korea government funding
In South Korea, government funding is made via its Ministry of Economy and Finance (MoEF), which announced a 26 trillion won support package for the chip industry in May 2024 and further support in October 24.
Much of the government’s focus is on a Semiconductor Cluster in Yongin, first announced in March 2019, then boosted in January 2024 with a total reported investment of 622 trillion won (US$472 billion) with Samsung and SK hynix. Yongin currently houses 21 fabs and the plan is for 16 more fabs by 2047, including three for research. In October 2024, Lam Research became the first global company to locate in the government’s Yongin semiconductor mega-cluster when it opened its new campus.
In addition to funding, MoEF supports the industry through high-tech subsidies and regulatory exemptions to expedite construction. It also launched its Top Tier project to set up a collaboration system with leading foreign research institutions with an investment of 10 billion won.
Historically, there has been animosity between Japan and South Korea, but in the face of a China/North Korea/Russia axis, Japan and South Korea are putting aside their differences, at least in the semiconductor world. For example, the chairman and CEO of SK Group told Nikkei Asia in May 2024 it aims to strengthen cooperation with Japanese chip equipment makers and would consider investing there. And the Japanese city of Yokohama announced in December 2023 that South Korea’s Samsung will invest around 40 billion yen (~$280 million) over five years in a facility for research into advanced chip packaging, per Reuters.
The EU’s Chips Joint Undertaking launched a semiconductor collaboration with South Korea in July 2024.
Chinese government funding
The Chinese government invests via its National Integrated Circuit Industry Investment Fund, created in 2014. Known as the Big Fund, it has three planned phases to address different aspects of the semiconductor industry. In May 2024, it raised about $48 billion for Big Fund III with 19 equity investors, led by the Ministry of Finance and state-owned banks. The Chinese American Semiconductor Professional Association (CASPA) is a neutral bridge between the countries.
Trendforce provided an Overview of China’s Semiconductor Industry Project Progress in 2024. A 2023 article from the South China Morning Post reported that the Chinese government awarded more than 12.1 billion yuan (US$1.75 billion) in subsidies to 190 domestic semiconductor companies in 2022, with the 10 biggest recipients getting 45%. SMIC was said to get the largest subsidy at 1.95 billion yuan, followed by Sanan Optoelectronics with 1.03 billion yuan. Other recipients were the chip packaging company Tianshui Huatian Technology, in Shaanxi; an Apple supplier, Wingtech Technology; Naura Technology, a chip equipment maker based in Beijing and supplier of Yangtze Memory Technologies (YMTC), which is U.S.-sanctioned; and Loongson Technology, a CPU designer.
A 2023 report from the Financial Times said that SMIC and Huawei, plus equipment suppliers Naura and Advanced Micro-Fabrication Equipment, will benefit from a policy shift offering access to additional government funding without having to achieve performance goals that were previously required.
The Chinese government also subsidizes TSMC Nanjing. In its March 2024 financial report, TSMC said its subsidiaries, such as JASM and TSMC Nanjing, received subsidies from the governments of Japan and China. For the three months ended March 31, 2024 and 2023, the company received a total of NT$183,484 thousand and NT$1,768,032 thousand, respectively, in the form of government grants.
And in its 2023 annual report TSMC said, “Subsidiaries such as JASM and TSMC Nanjing received subsidies from the governments of Japan and China, respectively, for local plants setup and operation … For the years ended December 31, 2023 and 2022, TSMC received a total of NT$47,545,898 thousand and NT$7,051,432 thousand as government grants respectively.” Trendforce noted that this was a 5.74-fold increase from the previous year, reaching a record high.
The U.S. Center for Strategic and International Studies (CSIS) published a deep dive on China’s strategy in the so-called chip wars. The Wall St. Journal also published an evaluation of China’s chipmaking progress.
Indian government funding
The Indian government’s Ministry of Electronics and Information Technology (MeitY) formed the Semicon India Program (Program for Development of Semiconductors and Display Manufacturing Ecosystem in India) and the India Semiconductor Mission (ISM) within its Digital India Corporation in 2021, with an initial budget of INR 76,000 crore (~$10 billion).
There are several schemes in place:
In September 2024, U.S. President Biden and India Prime Minister Modi partnered on plans to build a fab, and the U.S. Department of State partnered with the India Semiconductor Mission, Ministry of Electronics and IT, and Government of India to grow and diversify the global semiconductor ecosystem under the International Technology Security and Innovation (ITSI) Fund, created by the CHIPS Act.
For workforce development, key agencies and programs include the All India Council for Technical Education (AICTE) committee; the Chips to Startup (C2S) Program; and the ChipIN Center for students to access design infrastructure.
Like the U.S., individual Indian states also are running incentive programs. For example, Uttar Pradesh state’s policy provides for an additional capital subsidy of 50% on the capital subsidy approved under the India Semiconductor Mission. And the Karnataka Digital Economy Mission supports Electronics System Design and Manufacturing (ESDM) through a range of initiatives.
There is a potential total of $21 billion in proposals currently in progress in India, according to Bloomberg. India Briefing provides ongoing updates of investments. Information Technology and Innovation Foundation (ITIF) did a deep dive into India’s future role in the global supply chain.
Southeast Asia government funding
Many countries in Southeast Asia have chip ambitions. For example, the Philippines aims to train 128,000 engineers and technicians for semiconductors and electronics by 2028. The U.S. partnered with Indonesia to explore semiconductor supply chain opportunities. And Thailand is set to build its first SiC fab.
However, most activity in this region is concentrated in Malaysia, Vietnam, and Singapore, as shown below:
In Malaysia in 2023, the Ministry of Investment, Trade, and Industry (MITI) launched its New Industrial Master Plan (NIMP), proposing to allocate RM8.2 billion for implementation from 2024 until 2030, according to the Malaysian Investment Devlopment Authority. In May 2024, the government launched its National Semiconductor Strategy (NSS), aiming to draw RM500 billion (~$100B) of investment in integrated circuit (IC) design, advanced packaging, and manufacturing equipment for semiconductor chips, with an outlay of RM25 billion ($5 billion). MIDA is the government’s main investment promotion and development agency under MITI. There are also state initiatives, such as InvestPenang.
In Vietnam, the prime minister recently said the country would simplify procedures for semiconductor investments. In September 2024 it issued the strategy for development of Vietnam’s semiconductor industry by 2030, with a vision toward 2050. In April, the Ministry of Planning and Investment (MPI) detailed its semiconductor industry human resource development by 2030 project, with a vision extending out to 2045. It has a total required budget of about 26,000 billion VND, of which the state budget will contribute about 17,000 billion VND and socialized sources about 9,000 billion VND. By 2030 the program aims to train 50,000 engineers for the semiconductor industry across all stages of the value chain, and to build at least four national-level shared semiconductor centers with equipment at universities and the Vietnam National Innovation Center (NIC). NIC will enhance cooperation with partners such as local universities, Arizona State University, and companies such as Samsung, Cadence, Synopsys, and Siemens. Tax incentives also were promised. SEMIEXPO Vietnam was held in November, 2024 at NIC with many companies participating.
In Singapore in 2021, the government’s Economic Development Board (EDB) laid out its plan to grow its manufacturing sector by 50% by 2030, stating that more than one in 10 of the world’s semiconductor chips are produced by factories in the country. In 2022, Singapore invested an initial US$85 million to set up the National Gallium Nitride Technology Centre over five years and announced five manufacturing-sector industry transformation maps (ITMs) in areas such as electronics and precision engineering. Also in 2022, the Ministry of Trade and Industry launched the Manufacturing 2030 (M2030) Careers Initiative to help manufacturing companies develop attractive career options for Singapore residents. The National University of Singapore (NUS) offers a Master of Science in Semiconductor Technology and Operations (MSc (STO)) program. The state aims to be the smartest city in the world, via an initiative launched in 2014, and key innovations happen at its Jurong Innovation District (JID), a living lab and advanced manufacturing hub.
A 2024 Ernst & Young report stated that more than 140 countries have committed to implementing a 15% global minimum tax rate for large multinational enterprises between now and 2025, with Singapore among them. To offset this, Singapore introduced a Refundable Investment Credit (RIC), offering up to 50% support on each qualifying expenditure category for up to 10 years. For advanced manufacturing, the RIC scheme seeks to encourage R&D and innovation projects. Supplementing the RIC scheme was an additional $3 billion investment into Singapore’s Research, Innovation and Enterprise 2025 initiative.
A 2024 TrendForce report noted that, “given nine out of the top ten packaging and testing companies are located in the Asia-Pacific region, the strategic positioning in Asia is particularly notable, with Japan, Malaysia, and Singapore all striving to make their mark.”
| Location | Company/Date | Investment | Details | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| China (May 24) |
Phase 3 of the National Integrated Circuit Industry Investment Fund | The “Big Fund” has three phases: 2014 to 2019 (~$22B); 2019 to 2024 (~$30B); 2024 to 2039 (~$48B) for about $100B total | The latest round aims to boost large-scale manufacturing and equipment, materials, HBM, AI chips | ||||||||||||
| China: Shanghai (Aug 24) |
Shanghai Semiconductor Industry Investment Fund | Raised $1B from investors, many state-backed | The SSIIF is run by municipal government to support the local chip industry amid U.S. sanctions targeting | ||||||||||||
| India, USA (Sep 24) |
Govt. technology partnership, fab | Support from the India Semiconductor Mission and partnership between Bharat Semi, 3rdiTech, U.S. Space Force | Fab focused on advanced sensing, communication, and power electronics for national security, next generation telecommunications, and green energy applications | ||||||||||||
| India: Karnataka (Jul 24) |
Government of Karnataka | INR 245.67 crore (~ $29M), excluding land cost, including INR 122.83 crore from the Indian Ministry of Electronics and Information Technology (MeitY) | 235.5 acres to set up an electronics manufacturing cluster (EMC) at Kochanahalli Industrial Area in Mysuru district | ||||||||||||
| Japan (Jun 23) |
The Japan Investment Corp. | The JIC to buy JSR for about $6B | Secure national supply of materials for photoresists | ||||||||||||
| Japan (Nov 24) |
New assistance framework | ¥10 trillion (~$65B) | Revitalize semiconductor and AI industries to regain chip leadership | ||||||||||||
| Malaysia (May 24) |
National Semiconductor Strategy | Govt. to invest $5.3B in an effort to attract over $100B industry investment | Aims to establish at least 10 Malaysian companies in design, advanced packaging; offer the nation as a neutral location | ||||||||||||
| South Korea (May 24) |
Semiconductor Ecosystem Support Package | KRW 26 trillion (~$19.03B); see June 24 update and Oct 24 update | Establish semiconductor supremacy amid the intensified global battle; follows increased subsidies in Sep 23 | ||||||||||||
| Taiwan (Nov 23) |
Taiwan Chip-based Industrial Innovation Program | NT$300B (~$9.3B) for implementation between 2024 and 2033 | Leverage Taiwan’s leading global position in chip manufacture, packaging, testing to develop new applications through integrating Si chips with critical technologies such as GenAI; follows International and A+ subsidy programs | ||||||||||||
| Vietnam (Apr 24) |
Human resource development in semiconductor industry | Total required budget of about VND 26,000B (~$1B) of which the state budget to contribute about VND 17,000B (~$690.7M) and socialized sources about VND 9,000B ($365.7M) | Aims for Vietnamese engineers to deeply engage in the design processes, packaging, testing stages; master parts of packaging, testing technologies; gradually grasp production technologies | ||||||||||||
| Vietnam (Sep 24) |
Vietnam Semiconductor Industry Development Strategy | Investment not disclosed; targeting revenue of $25B by 2030 and $100B by 2050 | Phase 1 aims to set up 100 design companies, 1 small-scaled fab and 10 packaging, testing plants; develop specialized semiconductor products for several sectors; offers Vietnam as a safe new destination for the global supply chain | ||||||||||||
| Location | Company/Date | Investment | Details |
|---|---|---|---|
| China: Shanghai (Feb 24) |
SMIC, Huawai, others | Not disclosed but recipients of local govt. funding | SMIC to build two 300mm production lines; Huawei to build an R&D facility focused on chips, wireless networks, IoT |
| India: Assam (Feb 24) |
Tata Group | $3B with contribution from Assam govt. | OSAT focused on wire bond, flip, integrated systems packaging; Tata and Analog Devices also formed strategic alliance to support ecosystem |
| India: Gujarat (Sep 24) |
Kaynes | INR 3,300 crore (~$400M) with funding under India’s Semiconductor Mission | Assembly, testing plant in Sanand, Gujarat |
| India: Gujarat (Mar 24) |
CG Power, Renesas, Stars Microelectronics | INR 7,600 crore (~$900M) financed through subsidies, equity, borrowing; approved under India’s semiconductor scheme | OSAT facility with the JV 92.3% owned by CG |
| India: Gujarat (Feb 24) |
Tata, PSMC | Up to INR 91,000 crore (~US$11B); govt. contribution not disclosed | 12-inch fab producing up to 50,000 wafers a month; update |
| India: Gujarat (Jun 23) |
Micron | Up to $825M over two phases | DRAM and NAND assembly, test facility |
| India: Maharashtra (Sep 24) |
Tower/Adani JV | $10B (INR 83,947 crore) | Fab approved by state govt; awaiting approval by India Semiconductor Mission and the IT ministry |
| India: Uttar Pradesh (Jul 24) |
Tarq, Kaynes, Aditech, Vamasundari Investment Delhi, others | Total of about INR 40,038 crore (~$4.8B) in proposals | Under the state’s policy to incentivise semiconductor manufacturing and attract global investments |
| India (Sep 24) |
Multiple startups | So far, approved projects to cost Rs 342 crore and govt. committed Rs 133 crore under the Design Linked Incentive scheme | Projects include image sensor SoC for auto, industrial MCU, beamformer IC for satellite, RISC-V multi-core accelerators for telecom applications |
| Japan: Hokkaido (Apr 24) |
Rapidus | Govt. subsidies up to ¥590B (~$3.9B) in addition to previous investments | Partnership with IBM, imec for 2nm logic chips, advanced packaging |
| Japan: Kumamoto (Feb 24) |
Japan Advanced Semiconductor Manufacturing | Total investment in JASM to exceed $20B including Japan govt. contributions | Led by TSMC with Sony, DENSO, Toyota; two 12 inch fabs for auto, industrial, consumer, HPC |
| Japan, South Korea, USA (Jan 24) |
NTT, Intel, SK hynix | The Japanese govt. to provide about $300M | Optical semiconductors for NTT’s Optical and Wireless Network |
| Japan: Yokkaichi and Kitakami (Feb 24) |
Kioxia, Western Digital | Up to ¥150B (~$1B) subsidy; the facility at Yokkaichi also received up to ¥92.9B (~$647M) subsidy in 2022 | 3D flash memory based on wafer bonding and future advanced nodes |
| Japan (Nov 24) |
EdgeCortix | ¥4B(~$26M) subsidy from Japan’s NEDO | Energy-Efficient AI chiplets for post-5G communication systems |
| Malaysia: Penang (Jun 24) |
MKS Instruments | Not disclosed but supported by MIDA and InvestPenang | Super Center factory to support wafer fabrication equipment production |
| Malaysia: Selangor state (Apr 24) | Arm, others | Not disclosed but part of the govt.’s $5.6B pledge to support its semi industry | IC Design Park |
| South Korea (Apr 24) |
Samsung, SK hynix, Naver, Sapeon, more | KRW 9.4 trillion (~$6.94B) | Nurture domestic chip industry and bolster AI technology deployment through the AI-Chip Initiative |
| South Korea (Jan 24) |
Samsung, SK hynix, others | Total of 622 trillion won (~US$472B) | Establish exclusive zones for the fabless industry in Pangyo; foundry, memory chip production facilities in Hwaseong, Yongin, Icheon, and Pyeongtaek; total area of 21M sq-m, monthly production of 7.7M wafers |
| Taiwan (May 24) |
AMD | AMD to invest about NT$5B (~$155M) and receive a potential 50% subsidy under the A+ Industrial Innovative R&D Program | R&D center; govt. conditions include Taiwan-made AI chips, recruit at least 20% foreign talent |
| Taiwan, Czech Republic (Apr 24) |
Taiwan Semiconductor Research Institute, Czech Technical University in Prague | NT$300 billion (~$9.29B) from the National Science and Technology Council (NSTC) with NT$12B in the first year; part of Taiwan’s International Innovation and R&D Collaboration Program | Planned under the 10-year Taiwan Chip-based Industrial Innovation Program, the IC design training base in Prague aims to enhance international cooperation |
| Taiwan (Feb 24) |
Vanguard, others | NT$150M (~$4.6M) subsidy from the Department of Industrial Technology at MOEA under the A+ Enterprise Innovation R&D Quenching Plan | High-power, high-efficiency GaN on Qromis substrate technology (QST) component and process |
| Thailand (Sep 24) |
Hana Microelectronics, PTT | Initial investment of THB 11.5B (~$346.5M) from Thailand Board of Investment | Thailand’s first SiC fab, for power electronics for EVs, data centers, energy storage systems |
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