Challenges Grow For 5G Packages And Modules

By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Process Control For Next-Generation Memories

By Niranjan Khasgiwale - 18 Jul, 2019 - Comments: 0

The Internet of Things (IoT), Big Data and Artificial Intelligence (AI) are driving the need for higher speeds and more power-efficient computing. The industry is responding by bringing new memory technologies to the marketplace. Three new types of memory in particular—MRAM (magnetic random access memory), PCRAM (phase change RAM) and ReRAM (resistive RAM)—are emerging as leading candidat... » read more

Electronics Industry Business Cycles Look Promising

By Walt Custer - 18 Jul, 2019 - Comments: 0

Although total electronics industry manufacturing activity is still far from expanding (3/12 is below 1.0), key global electronic industry monthly time series appear to have reached their 3/12 bottoms and now have begun to improve (Chart 1). Currently shipments are still shrinking, but at slowing rates. However real growth will only occur when these 3/12s exceed 1.0. Growth rates vary b... » read more

Creating 2D Compounds

By Katherine Derbyshire - 18 Jul, 2019 - Comments: 1

A 2D material, by definition, has no surface dangling bonds. A bulk material with plate-like structure, such as graphite, is composed of thin layers with a weakly bonded cleavage plane between. What this means is a monolayer of graphite will seek to satisfy its exposed dangling bonds by absorbing other materials. A monolayer of graphene, in contrast, is energetically complete without a secon... » read more

Process Modeling Exploration for 8 nm Half-Pitch Interconnects

By Coventor - 17 Jul, 2019 - Comments: 0

In this paper, we simulate eSADP, eSAQP and iSAOP patterning options to enable fabrication of 8 nm Half-Pitch (HP) interconnects. We investigate the impact of process variations and patterning sensitivities on pitch walking and resistance performance. The overall yield is also calculated for eight line CDs as well as M2-via-M1 via segment resistance and compared for all options. Process sensiti... » read more

Wide Band Gap—The Revolution In Power Semiconductors

By Applied Materials - 17 Jul, 2019 - Comments: 0

New government regulations and industry standards are leading companies to adopt wide bandgap (WBG) power solutions, both to reduce their carbon footprint and to meet increasing demand for higher power systems aimed at electric vehicles, renewable energy, datacenters, and other markets. The automotive industry is one of the biggest markets driving demand for WBG power devices. The European U... » read more

A Novel Design Method of Highly Efficient Saturated Power Amplifier Based On Self-Generated Harmonic Currents

By Wolfspeed, a Cree Company - 17 Jul, 2019 - Comments: 0

A novel design method without requiring the special harmonic termination circuit for a highly efficient power amplifier (PA) is proposed. The proposed PA is driven into saturated operation, from the linear to knee region, by adjusting the only fundamental load, and the saturated operation induces self-generated harmonic currents. The current and voltage waveforms can be shaped easily by the har... » read more

Blog Review: July 17

By Jesse Allen - 17 Jul, 2019 - Comments: 0

Mentor's John McMillan takes a look at the three general classes that have been established by IPC-2221B to reflect progressive increases in sophistication, functional performance requirements, and testing/inspection frequency for PCBs. Synopsys' Dinesh Siwal and Thenmozhy Kaliyamurthy point out the new features and improvements in DisplayPort 2.0, including greater speeds, better power effi... » read more

Breaking Down The Debug Process

By Brian Bailey - 17 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. What fol... » read more

Memory In Microcontrollers

By Ed Sperling - 17 Jul, 2019 - Comments: 0

Gideon Intrater, CTO of Adesto, talks about how to use microcontrollers for applications where more memory is required, such as automotive, communication, and AI at the edge. Options include moving MCUs toward a more aggressive process node, adding external non-volatile memory, and execute-in-place types of architectures. » read more

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