Simulation Of A Kicked Ising Quantum System On The Heavy Hexagon Lattice
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Efficient Tensor Network Simulation of IBM’s Eagle Kicked Ising Experiment” was published by researchers at the Flatiron Institute and New York University. Abstract: "We report an accurate and efficient classical simulation of a kicked Ising quantum system on the heavy hexagon lattice. A simulation of this system was recently performed on a 127-qubit quantum pr... » read more

SW/HW Codesign For CXL Memory Disaggregation In Billion-Scale Nearest Neighbor Search (KAIST)
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Bridging Software-Hardware for CXL Memory Disaggregation in Billion-Scale Nearest Neighbor Search” was published by researchers at the Korea Advanced Institute of Science and Technology (KAIST) and Panmnesia. Abstract: "We propose CXL-ANNS, a software-hardware collaborative approach to enable scalable approximate nearest neighbor search (ANNS) services. To this e... » read more

A Method To Transform Everyday Materials Into Conductors For Use In Quantum Computers
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Controllable strain-driven topological phase transition and dominant surface-state transport in HfTe5” was published by researchers at University of California Irvine, Los Alamos National Laboratory, and University of Tennessee. Abstract: "The fine-tuning of topologically protected states in quantum materials holds great promise for novel electronic devices. Howe... » read more

Blog Review: Feb. 14
By Liz Allan - 14 Feb, 2024 - Comments: 0

Siemens’ Dilan Heredia and Karen Chow explain why fast, accurate parasitic extraction (PEX) is essential to design success, especially for the 3 nm node and GAAFETs. Synopsys’ Srinivas Velivala debunks the myth that layout-versus-schematic (LVS) checking is a static step in the chip development process, and details its evolving role in modern SoCs. Cadence’s Mark Seymour digs into a... » read more

Memory’s Future Hinges On Reliability
By Karen Heyman - 14 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of power and heat on off-chip memory, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

An Empirical Comparison Of Optimizers For Quantum Machine Learning With SPSA-Based Gradients
By Fraunhofer IIS/EAS - 14 Feb, 2024 - Comments: 0

Variational quantum algorithms (VQAs) have attracted a lot of attention from the quantum computing community for the last few years. Their hybrid quantum-classical nature with relatively shallow quantum circuits makes them a promising platform for demonstrating the capabilities of noisy intermediate scale quantum (NISQ) devices. Although the classical machine learning community focuses on gradi... » read more

How To Build Computer Vision Solutions
By Arm - 14 Feb, 2024 - Comments: 0

Computer vision devices that can ‘see’ and act on visual information are bringing new efficiencies and functionalities to IoT. But with new opportunities come complexities. The specific features and functionality of smart vision use cases vary widely. Creating a system that catches defects on an assembly line requires different imaging, machine learning, and workloads compared to one ... » read more

Fluid Kinematics Using Ansys Fluent
By Ansys - 14 Feb, 2024 - Comments: 0

This teaching package covers fluid kinematics topics. It includes description of fluid motion, introducing different co-ordinate systems used to mathematically calculate fluid flow behaviors and demonstrating different flow visualization and flow measurement techniques used in experimental methods and numerical simulations. Ansys Fluent has been utilized visualize these concepts. Click here ... » read more

Early Architecture Performance And Power Analysis Of Multi-Die Systems
By Synopsys - 14 Feb, 2024 - Comments: 0

A multi-die system is a semiconductor device in which multiple homogeneous or heterogeneous dies are contained within a single package. Multi-die systems have been available for select uses for years, but they are gaining wider popularity and are expected to be used in a wide variety of end applications, including high-performance computing, automotive, and mobile. There are two main factors dr... » read more

Sigrity X — Redefining Signal And Power Integrity
By Cadence - 14 Feb, 2024 - Comments: 0

This white paper highlights the features in Cadence Sigrity X signal and power integrity (SI/PI) solutions for system-level SI and PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows with confidence. Click here to read more. » read more

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