An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs) 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "All Electrohydrodynamic Printed Flexible Organic Thin Film Transistors" was published by researchers at North Carolina State University. Abstract: "The demand of cost-effective fabrication of printed flexible transistors has dramatically increased in recent years due to the need for flexible interface devices for various application including e-skins, wearables, and ... » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

Impact of CMOS Image Sensors Fabrication Processes On The Quality Of Smartphone Pictures
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. Abstract: "CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of ima... » read more

A Photonic Circuit Architecture Allowing Faster, More Efficient Transfer of Large Amounts of Data
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "Massively scalable Kerr comb-driven silicon photonic link" was published by researchers at Columbia University and Air Force Research Laboratory. Abstract: "The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limi... » read more

How To Use S-Parameters For Power Module Verification
By Wilfried Wessel - 06 Jul, 2023 - Comments: 0

By Wilfried Wessel (Siemens EDA), Simon Liebetegger (University of Applied Sciences Darmstadt), and Florian Bauer (Siemens EDA) Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], such as wide bandgap semiconductors, including silicon carbide (SiC) ... » read more

Confusion Grows Over Sensor Fusion In Autos
By Ann Mutschler - 06 Jul, 2023 - Comments: 0

A key strategy for fully autonomous vehicles is the ability to fuse together inputs from multiple sensors, which is essential for making safe and secure decisions, but it's turning out to be much harder than first imagined. There are multiple problems that need to be solved, including how to partition, prioritize, and ultimately combine different types of data, and how to architect the proce... » read more

Silicon Root Of Trust IP And The Automotive Chain Of Trust
By Adiel Bahrouch - 06 Jul, 2023 - Comments: 0

Cybersecurity attacks in the automotive industry have increased in magnitude, frequency and sophistication in recent years. According to IDC, there have been more than 900 publicly reported automotive security incidents since 2010, and this number is growing year over year. New attack vectors are emerging all the time. For example, attacks on the EV charging infrastructure reached 4% of total i... » read more

Solving The Last-Mile Delivery Problem
By John Koon - 06 Jul, 2023 - Comments: 0

Retailers are deploying robots to cut costs and improve efficiency, opening new opportunities for chipmakers as well as a host of new challenges. Key to this strategy are autonomous roadside delivery robots (ARDRs). Retailers have been facing razor-thin profit margins for years and have turned their sights to increasing operational efficiency to stay competitive. Solving the last-mile delive... » read more

A Safety Verification Methodology For Automotive Semiconductors
By Alessandra Nardi - 06 Jul, 2023 - Comments: 0

By Alessandra Nardi (Synopsys), Teo Cupaiuolo (Synopsys), and Liu Min (SGS-TÜV Saar) Functional safety has been a long-standing requirement for many electronics applications, including implanted medical devices, space-borne systems, and nuclear power plants. The widespread use of advanced driver assistance systems (ADAS) and the advent of self-driving vehicles have added automotive chips to... » read more

The Design Automation Conference Turns 60! What’s Hot? What’s Next?
By Frank Schirrmeister - 06 Jul, 2023 - Comments: 0

This coming week from July 9th to July 13th, experts from all over the world will descend on the Moscone Center in San Francisco to discuss aspects of what we call "Electronic Design Automation" (EDA) and typically associate with hardware development. There will be many celebratory elements this year, given the milestone of 60 years. Industry luminary Alberto Sangiovanni Vincentelli will give o... » read more

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