3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

Photonics: GaSb/SiN Tunable Hybrid Integrated Laser
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "Widely tunable 2 µm hybrid laser using GaSb semiconductor optical amplifiers and a Si3N4 photonics integrated reflector" was published by researchers at Tampere University in Finland. Abstract: "Tunable lasers emitting in the 2–3 µm wavelength range that are compatible with photonic integration platforms are of great interest for sensing applications. To ... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Mar, 2023 - Comments: 0

TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 24 Mar, 2023 - Comments: 0

Automotive, mobility Ford expects to lose $3 billion from EV sales this year, but said that part of the business will begin generating profits soon. The company still expects to hit its overall profit numbers for the year, however. Volvo is making a new electric vehicle (EV) in China and exporting it to Europe and Japan, according to a Nikkei Asia interview. Volvo is owned by Zhejiang Geely... » read more

Week In Review: Design, Low Power
By Linda Christensen - 24 Mar, 2023 - Comments: 0

Renesas will acquire Panthronics, a fabless semiconductor company specializing in high-performance wireless products, expanding its reach into near-field communications for financial, IoT, asset tracking, wireless charging, and automotive applications. The two companies already had collaborated on designs for mobile point-of-sale terminals, wireless charging, and smart metering. Renesas also... » read more

Innovations in Device Design of The Gate-All-Around (GAA) Nanosheet FETs (IBM Research)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A technical paper titled "A Review of the Gate-All-Around Nanosheet FET Process Opportunities" was published by researchers at IBM Research Albany. Abstract: "In this paper, the innovations in device design of the gate-all-around (GAA) nanosheet FET are reviewed. These innovations span enablement of multiple threshold voltages and bottom dielectric isolation in addition to impact of channel... » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Integrating MEMS with Standardized Silicon Photonics Technology
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Integrated silicon photonic MEMS" was published by researchers at EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute. Abstract Excerpt "Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standar... » read more

Feasibility of Using Domain Wall-Magnetic Tunnel Junction for Magnetic Analog Addressable Memories
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data" was published by researchers at UT Austin and Samsung Advanced Institute of Technology (SAIT). Abstract "With the rise in in-memory computing architectures to reduce the compute-memory bottleneck, a new bottleneck is present between analog and digital conver... » read more

RISC-V Disrupting EDA
By Brian Bailey - 23 Mar, 2023 - Comments: 3

The electronic design automation (EDA) industry started in the 1980s and primarily was driven by the test and PCB industries. The test industry was focused on simulation so that test vector sets could be developed and optimized. The PCB industry needed help managing complexity as system sizes grew. That complexity soon was eclipsed by IC complexity and the costs associated with making a mist... » read more

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