2D-Materials-Based Electronic Circuits (KAUST and TSMC)


A special edition article titled "Electronic Circuits made of 2D Materials" was just published by Dr. Mario Lanza, KAUST Associate Professor of Material Science and Engineering, and Iuliana Radu, corporate researcher at TSMC. This special issue covers 21 articles from leading subject matter experts, ranging from materials synthesis and their integration in micro/nano-electronic devices and c... » read more

Rubbery Schottky Diodes Based on Soft, Stretchy Electronic Materials (Penn State)


A new technical paper titled "Fully rubbery Schottky diode and integrated devices" was published by researchers at Penn State University. The Office of Naval Research and the National Science Foundation funded this research. "Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and... » read more

Hardware Security: New Mathematical Model To Quantify Information Flow in Digital Circuits For Different Attack Models (RWTH Aachen)


A new technical paper titled "Quantitative Information Flow for Hardware: Advancing the Attack Landscape" was published by researchers at RWTH Aachen University. Abstract: "Security still remains an afterthought in modern Electronic Design Automation (EDA) tools, which solely focus on enhancing performance and reducing the chip size. Typically, the security analysis is conducted by hand, l... » read more

HW-Enabled Security Techniques To Improve Platform Security And Data Protection For Cloud Data Centers And Edge Computing (NIST)


A technical paper titled "Hardware-Enabled Security: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases" was published by NIST, Intel, AMD, Arm, IBM, Cisco and Scarfone Cybersecurity. Abstract: "In today’s cloud data centers and edge computing, attack surfaces have shifted and, in some cases, significantly increased. At the same time, hacking has becom... » read more

Fabricating FeFET Devices with Silicon-Doped Hafnium Oxide As A Ferroelectric Layer


A new technical paper titled "Synergistic Approach of Interfacial Layer Engineering and READ-Voltage Optimization in HfO2-Based FeFETs for In-Memory-Computing Applications" was published by researchers at Fraunhofer IPMS, GlobalFoundries, and TU Bergakademie Freiberg. Abstract (partial) "This article reports an improvement in the performance of the hafnium oxide-based (HfO2) ferroelectric... » read more

Systematic Yield Issues Now Top Priority At Advanced Nodes


Systematic yield issues are supplanting random defects as the dominant concern in semiconductor manufacturing at the most advanced process nodes, requiring more time, effort, and cost to achieve sufficient yield. Yield is the ultimate hush hush topic in semiconductor manufacturing, but it's also the most critical because it determines how many chips can be profitably sold. "At older nodes, b... » read more

Adopting Predictive Maintenance On Fab Tools


Predictive maintenance, based on more and better sensor data from semiconductor manufacturing equipment, can reduce downtime in the fab and ultimately cut costs compared with regularly scheduled maintenance. But implementing this approach is non-trivial, and it can be disruptive to well-honed processes and flows. Not performing maintenance quickly enough can result in damage to wafers or the... » read more

Metrology Sampling Plans Are Key For Device Analytics And Traceability


A mother steps on the brakes, bringing her car to a stop as she drops her kids off for dance lessons. At the time, she doesn't notice anything wrong, but when she takes her car in for its regular service appointment, the mechanic conducts a diagnostic check and discovers that the primary brake system on the car had failed because of a faulty braking controller without anyone realizing it. Fortu... » read more

High Voltage Testing Races Ahead


Voltage requirements are increasing, especially for the EV market. Even devices that might be considered relatively low voltage, such as display drivers, are now pushing past established baselines. While working with high voltages is nothing new — many engineers can recall yellow caution tape in their workplaces — the sheer number and variety of new requirements have made testing at high... » read more

Manage Your Risk In RISC-V


Adoption of RISC-V processors is accelerating. This technology, like everything, comes with benefits and risks. The open standard means freedom for many developers, but success depends on the development of a support ecosystem around RISC-V. Industry collaboration is making broad adoption of RISC-V possible, and one example is the introduction of efficient trace for RISC-V cores. When incorp... » read more

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