Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices


New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Hardware Dynamic IFT Mechanism That Scales to Complex Open-Source RISC-V Processors


New technical paper titled "CellIFT: Leveraging Cells for Scalable and Precise Dynamic Information Flow Tracking in Hardware Designs" by researchers at ETH Zurich and Intel.  Paper to be presented at USENIX Security 2022 (August 10-12, 2022) in Boston, MA, USA. Partial Abstract "We introduce CELLIFT, a new design point in the space of dynamic IFT [Information flow tracking] for hardware. C... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield


New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

Graphene Nanoribbon Transistors Using Hydrocarbon Seeds (University of Wisconsin-Madison)


New research paper titled "Graphene nanoribbons initiated from molecularly derived seeds" from researchers at University of Wisconsin-Madison with contributions from Argonne National Laboratory. Abstract "Semiconducting graphene nanoribbons are promising materials for nanoelectronics but are held back by synthesis challenges. Here we report that molecular-scale carbon seeds can be exploi... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration


New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

More Robust Solid-State Lithium-Ion Batteries


New research paper titled "Xenon Ion Implantation Induced Surface Compressive Stress for Preventing Dendrite Penetration in Solid-State Electrolytes" from University of Surrey. Abstract "Solid-state electrolytes (SSEs) have been thrust into the limelight for the revival of energy-dense lithium metal batteries, but still face the challenge of failure caused by the dendrite penetration. Mou... » read more

End-to-End System for Object Localization By Coupling pMUTs to a Neuromorphic RRAM-based Computational Map


New research paper titled "Neuromorphic object localization using resistive memories and ultrasonic transducers" from researchers at CEA, LETI, Université Grenoble Alpes and others. Abstract "Real-world sensory-processing applications require compact, low-latency, and low-power computing systems. Enabled by their in-memory event-driven computing abilities, hybrid memristive-Complementary... » read more

Power Domain Implementation Challenges Escalate


The number power domains is rising as chip architects build finer-grained control into chips and systems, adding significantly to the complexity of the overall design effort. Different power domains are an essential ingredient in partitioning of different functions. This approach allows different chips in a package, and different blocks in an SoC, to continue running with just enough power t... » read more

Deep Reinforcement Learning to Dynamically Configure NoC Resources


New research paper titled "Deep Reinforcement Learning Enabled Self-Configurable Networks-on-Chip for High-Performance and Energy-Efficient Computing Systems" from Md Farhadur Reza at Eastern Illinois University. Find the open access technical paper here. Published June 2022. M. F. Reza, "Deep Reinforcement Learning Enabled Self-Configurable Networks-on-Chip for High-Performance and Energ... » read more

ETH Zurich: PIM (Processing In Memory) Architecture, UPMEM & PrIM Benchmarks


New paper technical titled "Benchmarking a New Paradigm: An Experimental Analysis of a Real Processing-in-Memory Architecture" led by researchers at ETH Zurich. Researchers provide a comprehensive analysis of the first publicly-available real-world PIM architecture, UPMEM, and introduce PrIM (Processing-In-Memory benchmarks), a benchmark suite of 16 workloads from different application domai... » read more

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