Benchmarking Highly Parallel Hardware for Spiking Neural Networks in Robotics
By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract: "Animal brains still outperform even the most performant machines with significantly lower speed. Nonetheless, impressive progress has been made in robotics in the areas of vision, motion- and path planning in the last decades. Brain-inspired Spiking Neural Networks (SNN) and the parallel hardware necessary to exploit their full potential have promising features for robotic applica... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Smart Glasses, Augmented Reality, And Time-of-Flight Imaging
By Edmund Neo - 20 Dec, 2021 - Comments: 0

By Edmund Neo and Rolf Weber Augmented reality (AR) is frequently discussed for providing new, exciting, vision-related products for consumer and industrial applications. One popular AR implementation uses AR glasses. While the global market for smart augmented reality glasses was only 255,600 units in 2020, market researchers predict robust growth and a volume of 8.8 million units by 2026 [... » read more

Perspectives On Why EUV Photomasks Are More Expensive
By Jan Willis - 20 Dec, 2021 - Comments: 0

There are fewer photomasks per wafer using EUV lithography, but each EUV photomask is more expensive. Given that, it’s not a surprise that a majority (74%) of industry luminaries surveyed in July say that EUV photomasks will contribute to an increase in photomask revenues for 2021 as shown in figure 1. In a 20-minute video, a panel of experts share their perspectives on what drives EUV photom... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Dec, 2021 - Comments: 0

Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Dec, 2021 - Comments: 0

Memory CEA-Leti demonstrated 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node. It utilizes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm² and solder reflow compatibility for the first time for this type of memory. The researchers anticipate it will be useful for embedded applications such at IoT and wearable dev... » read more

Continuous Integration For Digital Design
By Christian Skubich - 17 Dec, 2021 - Comments: 0

By Christian Skubich and Nico Peter In 2001, the Manifesto for Agile Software Development [1] laid the foundation for many modern software development processes. Today, 20 years later, agile methods are in widespread use in numerous domains. Out of the participants in the study Status Quo (Scaled) Agile 2020 [2], only 9% still relied on classic project management methods. One core element... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Dec, 2021 - Comments: 0

Automotive Features of Toyota’s key fobs for entering vehicles get turned off when drivers do not start paying a subscription fee when the complementary subscriptions end, says an article in Ars Technica. SiLC Technologies announced its compact Eyeonic Vision Sensor, a FMCW lidar sensor, is now commercially available. The sensor has a silicon photonic chip that keeps a lidar’s size down... » read more

GaN Application Base Widens, Adoption Grows
By Patrick Waurzyniak - 16 Dec, 2021 - Comments: 0

Gallium nitride (GaN) is beginning to show up across a broad range of power semiconductor applications due to its wide bandgap, enabling fast-charging, very high speeds, and much smaller form factors than silicon-based chips. Unlike silicon carbide (SiC), another wide-bandgap technology, GaN is a lateral rather than a vertical device. GaN tops out at about 900 volts, which limits its use in ... » read more

Batteries Have Moving Parts
By Katherine Derbyshire - 16 Dec, 2021 - Comments: 0

The race is on to make lithium-ion batteries safer, to increase the amount of energy that can be drawn out of these devices, and to reduce the time it takes to charge them up again. Transistors and other electronic components depend on the movement of electrons, which are effectively massless and dimensionless relative to the semiconductor, metal, and dopant atoms that surround them. A batte... » read more

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