Big Payback For Combining Different Types Of Fab Data


Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging


The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Engineers’ Experiences Around The World


As CTO, I see my role partially as strengthening the engineering community through program reviews, engineering education programs, conferences, seminars, and the product life cycle process at KLA. I also think it is critically important to spark engineering enthusiasm – helping engineers rediscover the excitement and curiosity that helps drive innovation. When inspired to create, engineers c... » read more

Manufacturing Bits: Dec. 6


China’s rare earth power play Rare earth elements (REEs) are back in the news. China, the world’s largest supplier of rare earths, plans to combine three domestic vendors to create a large state-owned company with a nearly 70% share of the REE market, according to reports from Nikkei and others. In 2020, China in total accounted for 85% of global production of refined REEs, accordi... » read more

Improving Energy And Power Efficiency In The Data Center


Energy costs in data centers are soaring as the amount of data being generated explodes, and it's being made worse by an imbalance between increasingly dense processing elements that are producing more heat and uneven server utilization, which requires more machines to be powered up and cooled. The challenge is to maximize utilization without sacrificing performance, and in the past that has... » read more

Power/Performance Bits: Dec. 6


Tunable 2D semiconductors Researchers from the Singapore University of Technology and Design (SUTD), Hengyang Normal University, Nanjing University, National University of Singapore, and Zhejiang University identified a family of 2D semiconductors that could have lower resistance and enable further scaling. “Due to the quantum tunnelling effect, shrinking a silicon-based transistor too sm... » read more

Week In Review: Manufacturing, Test


Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Week In Review: Design, Low Power


Infineon Technologies acquired Syntronixs Asia, which specializes in precision electroplating, a key process in the assembly process of semiconductors. Syntronixs Asia has a workforce of more than 500 people and has been a major service provider for Infineon since 2009. “Through this acquisition, we have made another important step to strengthen the resilience of our supply chain,” said Tho... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The U.S. Federal Trade Commission (FTC) sued Nvidia to block the company’s $40 billion acquisition of Arm. The FTC said in a press statement that “the proposed vertical deal would give one of the largest chip companies control over the computing technology and designs that rival firms rely on to develop their own competing chips. … the combined firm would have the means and in... » read more

Adaptive NN-Based Root Cause Analysis in Volume Diagnosis for Yield Improvement


Abstract "Root Cause Analysis (RCA) is a critical technology for yield improvement in integrated circuit manufacture. Traditional RCA prefers unsupervised algorithms such as Expectation Maximization based on Bayesian models. However, these methods are severely limited by the weak predictive capability of statistical models and can’t effectively transfer the yield learning experience from old... » read more

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