Week In Review: Manufacturing, Test

By Mark LaPedus - 15 Oct, 2021 - Comments: 0

Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 15 Oct, 2021 - Comments: 0

Nvidia acquired Oski Technology. Oski provides formal verification methodologies and consulting services, and Nvidia said that the acquisition will allow it to increase its investment in formal verification strategies. Oski's Gurugram, India, design center will become Nvidia's fourth engineering office in the country. Based in San Jose, Calif., it was founded in 2005. Terms of the deal were not... » read more

Week In Review: Auto, Security, Pervasive Computing

By SE Staff - 15 Oct, 2021 - Comments: 0

Automotive Synopsys and 3D virtual-environment company Dassault Systèmes are collaborating on an automotive lighting system development platform. Synopsys’ optical design tools — LucidShape, LightTools, and CODE V — will be integrated with Dassault Systèmes' 3DEXPERIENCE Platform, which is used by automotive teams from different disciplines to work together on designs and simulations. ... » read more

Leveraging Symbolic Simulations For IO Verification

By Moninder Singh - 14 Oct, 2021 - Comments: 0

IO libraries and interface IPs are an important part of any integrated circuit design that needs to communicate with the outside world or other integrated circuits. Interface IPs are the literal gatekeepers to the flow of logical and electrical information from one IC to another to form today’s complex computer systems, influencing almost every aspect of our lives these days. Interface IPs (e... » read more

Six Things We Might Need For Pervasive Computing

By Remy Pottier - 14 Oct, 2021 - Comments: 1

There is little doubt that digital technology will become more pervasive than it is even now in the coming decades. Organizations like the Exponential Group argue that digital should be the first step in sustainability, estimating that hardware and software could help reduce emissions by 15% by 2030 and beyond by helping fine-tune buildings, factories, and other environments. Cars—already ... » read more

HBM3: Big Impact On Chip Design

By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Challenges In RF Design

By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Architecting Interposers

By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

How To Identify Common Electronic Failures

By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

Will Co-Packaged Optics Replace Pluggables?

By Bryon Moyer - 14 Oct, 2021 - Comments: 0

As optical connections work their way deeper into the data center, a debate is underway. Is it better to use pluggable optical modules or to embed lasers deep into advanced packages? There are issues of convenience, power, and reliability driving the discussion, and an eventual winner isn’t clear yet. “The industry is definitely embracing co-packaged optics,” said James Pond, principal... » read more

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