Cleaning Up During IC Test
By Anne Meixner - 06 Jul, 2021 - Comments: 2

Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to increasing pin and ball density, and as more chips are bundled together in a package, the cost of dirt continues to be a focus. Cleaning recipes for test interface boards are changing, and analy... » read more

What Does It Take To Build A Successful Multi-Chip Module Factory?
By Mike McIntyre - 06 Jul, 2021 - Comments: 0

When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an announcement about “Company XYZ” moving their products into the fan-out wafer-level packaging (FOWLP) or fan-out panel-level packaging (FOPLP) space. But these moves come with challenges that didn’t ex... » read more

Development Of High Voltage General-Purpose Pin-Electronics
By Advantest - 06 Jul, 2021 - Comments: 0

Currently, there is a demand in Automated Test Equipment (ATE) to test both high-speed/low-voltage amplitude devices manufactured in advanced processes and low-speed / high-voltage amplitude devices manufactured in legacy processes by a pin-electronics equipment. However, it is difficult to achieve both the operating speed over than 1Gbps and the wide I/O range over than 10Vpp, due to the trade... » read more

Driving Toward Predictive Analytics With Dynamic Parametric Test
By Alan Hart - 06 Jul, 2021 - Comments: 0

The foundation of parametric test within semiconductor manufacturing is its usefulness in determining that wafers have been fabricated properly. Foundries use parametric test results to help verify that wafers can be delivered to a customer. For IDMs, the test determines whether the wafers can be sent on for sorting. Usually inserted into the semiconductor manufacturing flow during wafer fabric... » read more

IC Data Hot Potato: Who Owns And Manages It?
By SE Staff - 06 Jul, 2021 - Comments: 1

Modern inspection, metrology, and test equipment produces a flood of data during the manufacturing and testing of semiconductors. Now the question is what to do with all of that data. Image resolutions in inspection and metrology have been improving for some time to deal with increased density and smaller features, creating a downstream effect that has largely gone unmanaged. Higher resoluti... » read more

Advanced mm-Wave And Terahertz Measurements With Cascade Probe Stations
By FormFactor - 06 Jul, 2021 - Comments: 0

The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

Efficient Multi-GPU Shared Memory via Automatic Optimization of Fine-Grained Transfers
By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Harini Muthukrishnan (U of Michigan); David Nellans, Daniel Lustig (NVIDIA); Jeffrey A. Fessler, Thomas Wenisch (U of Michigan). Abstract—"Despite continuing research into inter-GPU communication mechanisms, extracting performance from multiGPU systems remains a significant challenge. Inter-GPU communication via bulk DMA-based transfers exposes data transfer latency on the GPU’s critical... » read more

SARA: Scaling a Reconfigurable Dataflow Accelerator
By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Yaqi Zhang, Nathan Zhang, Tian Zhao, Matt Vilim, Muhammad Shahbaz, Kunle Olukotun (Stanford) Abstract—"The need for speed in modern data-intensive workloads and the rise of “dark silicon” in the semiconductor industry are pushing for larger, faster, and more energy and areaefficient architectures, such as Reconfigurable Dataflow Accelerators (RDAs). Nevertheless, challenges remain in d... » read more

REDUCT: Keep It Close, Keep It Cool – Scaling DNN Inference on Multi-Core CPUs with Near-Cache Compute
By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Abstract—"Deep Neural Networks (DNN) are used in a variety of applications and services. With the evolving nature of DNNs, the race to build optimal hardware (both in datacenter and edge) continues. General purpose multi-core CPUs offer unique attractive advantages for DNN inference at both datacenter [60] and edge [71]. Most of the CPU pipeline design complexity is targeted towards optimizin... » read more

RaPiD: AI Accelerator for Ultra-low Precision Training and Inference
By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Abstract—"The growing prevalence and computational demands of Artificial Intelligence (AI) workloads has led to widespread use of hardware accelerators in their execution. Scaling the performance of AI accelerators across generations is pivotal to their success in commercial deployments. The intrinsic error-resilient nature of AI workloads present a unique opportunity for performance/energy i... » read more

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