The Next Generation of Testbench Debug Productivity
By Synopsys - 08 Jun, 2021 - Comments: 0

It is widely accepted that verification consumes at least sixty percent of time and resources on most semiconductor development projects. This statistic has been borne out by many industry surveys over the last twenty years. Verification technology has had to evolve to accommodate ever larger and more complex designs. Innovations such as constrained-random simulation and the Universal Verificat... » read more

Making Lidar More Useful
By Ed Sperling - 07 Jun, 2021 - Comments: 0

Lidar, one of a trio of “vision” technologies slated for cars of the future, is improving both in terms of form and function. Willard Tu, director of automotive at Xilinx, talks with Semiconductor Engineering about different approaches and tradeoffs between cost, compute intensity and resolution, various range and field of view options, and why convolutional neural networks are so important... » read more

Manufacturing Bits: June 7
By Mark LaPedus - 07 Jun, 2021 - Comments: 0

High-voltage superjunction SiC devices The University of Warwick and Cambridge Microelectronics have presented a paper on the latest effort to develop of a new type silicon carbide (SiC) power device called a SiC superjunction Schottky diode. Researchers have simulated and optimized the development of 4H-SiC superjunction Schottky diodes at a voltage class of 1700 volts, aiming for breakdow... » read more

Power/Performance Bits: June 7
By Jesse Allen - 07 Jun, 2021 - Comments: 0

Commercializing photonic MEMS Researchers from the University of California Berkeley, Daegu Gyeongbuk Institute of Science & Technology, SUSS MicroOptics, TSI Semiconductors, Gwangju Institute of Science and Technology, KAIST, Ecole Polytechnique Fédérale de Lausanne (EPFL), and Korea Polytechnic University demonstrated a path for commercial fabrication of photonic MEMS. Photonic MEMS... » read more

Where Imperfections Lead To Opportunity
By Evelyn Hu - 07 Jun, 2021 - Comments: 0

By Evelyn Hu It is natural to hold a bias that assumes that the highest-quality devices are those formed from the most perfect materials (crystalline, well-ordered, stoichiometric). Therefore, it is ironic, and perhaps counterintuitive, that particular kinds of defects, such as vacancies (missing atoms) in semiconductor materials, can form the building blocks of a new quantum information tec... » read more

Configuring AI Chips
By Ed Sperling - 04 Jun, 2021 - Comments: 0

Change is almost constant in AI systems. Vinay Mehta, technical product marketing manager at Flex Logix, talks about the need for flexible architectures to deal with continual modifications in algorithms, more complex convolutions, and unforeseen system interactions, as well as the ability to apply all of this over longer chip lifetimes. Related Dynamically Reconfiguring Logic A differ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Nextflow Software, a provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of the Simcenter software portfolio, providing rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gear box lubri... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 04 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back To simplify IoT workflows, Arm announced that it is putting parts of its Common Microcontroller Software Interface Standard (CMSIS) into an open project called Open-CMSIS-Pack. The CMSIS is a vendor-independent abstraction layer for MCUs, especially Arm Cortex-M processors, that makes it possible for developers to deal with softwa... » read more

Automotive AI Hardware: A New Breed
By Kurt Shuler - 03 Jun, 2021 - Comments: 0

Arteris IP functional safety manager Stefano Lorenzini recently presented “Automotive Systems-on-Chip (SoCs) with AI/ML and Functional Safety” at the Linley Processor Conference. A main point of the presentation was that conventional wisdom on AI hardware markets is binary. There’s AI in the cloud: Big, power-hungry, general-purpose. And there’s AI at the edge: Small, low power, limited... » read more

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